Stimulus-Responsive Homopolymer Coating for Residue-Free Substrate Protection
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Solution Overview
Problem
Semiconductor fabrication processes face challenges in protecting sensitive surfaces from airborne molecular contaminants and unwanted interactions such as oxidation and corrosion, as existing solutions are costly and pose safety and reliability concerns.
Innovation Solution
A stimulus-responsive polymer (SRP) with a homopolymer structure is used for deposition on substrates, providing a protective film that can be residue-free removed under mild conditions, filling small features, and protecting sensitive substrates from environmental threats.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional protective methods (nitrogen-filled storage cassettes or vacuum-integrated tools) are used to protect semiconductor substrates from airborne molecular contaminants, then substrate protection from oxidation and corrosion is improved, but device complexity and operational cost increase significantly
Solution Approach 1:
The patent employs a disposable sacrificial polymer coating that is deposited on the substrate surface and then intentionally removed after serving its protective function. This eliminates the need for complex reusable protective equipment like nitrogen-filled storage cassettes or vacuum-integrated tools, while still providing effective protection from airborne molecular contaminants during queue time.
Solution Approach 2:
The protective function is extracted from complex equipment systems and transferred to a simple polymer coating layer applied directly to the substrate. This extraction simplifies the overall system by removing the need for specialized storage infrastructure while maintaining the core protective capability against oxidation and corrosion.
2Loss of substance
If aggressive removal methods are used to remove protective films from substrates, then complete film removal is achieved, but substrate damage risk increases
Solution Approach 1:
The patent utilizes controlled changes in environmental parameters (temperature, humidity, exposure to specific chemicals or light) to trigger the removal of the sacrificial polymer coating. By carefully selecting and controlling these parameter changes, the coating can be completely removed through gentle processes that do not damage the underlying sensitive substrate, unlike aggressive mechanical or chemical methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SRP effectively protects semiconductor surfaces from contaminants and allows for residue-free removal, reducing the risk of substrate damage and operational costs while maintaining surface integrity.
Implementation Method 1
stimulus responsive polymer (SRP) that includes or is a homopolymer... allows for residue-free removal under mild conditions
Data Source
AI summary
The present disclosure relates to a stimulus responsive polymer (SRP) that includes a homopolymer. Methods, films, and formulations employing an SRP are also described herein.