Honeycomb Conductive Feature Layout for Higher Package Bandwidth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit packages face challenges in increasing data transfer density and bandwidth due to limitations in the arrangement of conductive features, which restrict the number of parallel communication paths and overall signal communication efficiency.
Innovation Solution
The use of a honeycomb pattern for conductive features such as bond pads, bumps, and through-vias increases the density of these features per unit area without increasing their pitch, thereby enhancing signal communication bandwidth by creating more parallel communication paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional square patterns are used for conductive features, then the arrangement is simple and manufacturing is easier, but the density of conductive features per unit area is lower
Solution Approach 1:
The patent applies asymmetry by transitioning from a symmetric square pattern to an asymmetric honeycomb pattern. The honeycomb structure uses hexagonal cells with specific geometric relationships (60-degree angles, varying cell sizes) that break the symmetry of conventional square arrangements. This asymmetric design enables higher feature density while maintaining manufacturability through defined geometric constraints.
Solution Approach 2:
The patent employs dimensionality change by introducing a two-dimensional honeycomb lattice structure that optimizes space utilization in the planar domain. The pattern uses interconnected hexagonal cells that efficiently pack conductive features across the substrate surface, achieving higher density compared to one-dimensional row-based square patterns while maintaining a two-dimensional layout suitable for standard manufacturing processes.
2Quantity of substance
If the pitch of conductive features is reduced to increase density, then more features fit in the same area, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by varying the geometric parameters of the honeycomb pattern, specifically the cell size and spacing, to optimize feature density. The design uses a range of cell sizes (e.g., 5-20 micrometers) and adjusts the pitch parameters to achieve desired density while maintaining manufacturability. This parametric approach allows flexibility in balancing density and manufacturing precision requirements.
Solution Approach 2:
The patent uses segmentation by dividing the substrate into multiple honeycomb cells, each containing conductive features. This segmentation creates a modular structure where features are distributed across discrete cells, allowing independent optimization of each cell's parameters. The segmented honeycomb lattice enables high overall density while maintaining reasonable pitch within individual cells, reducing the stringency of pitch control requirements.
3Productivity
If more parallel communication paths are created, then bandwidth increases, but the area occupied by conductive features increases
Solution Approach 1:
The patent applies merging by combining multiple communication paths through the shared honeycomb lattice structure. The interconnected hexagonal cells create multiple parallel signal pathways that share common conductive elements and routing channels. This merging approach enables high bandwidth by providing numerous parallel paths while reducing total area compared to completely separate, non-sharing communication channels.
Solution Approach 2:
The patent employs universality by designing the honeycomb pattern to serve multiple functions simultaneously: it provides mechanical support, electrical connectivity, and multiple parallel communication paths. The same hexagonal lattice structure that provides structural integrity also creates numerous signal routing pathways, eliminating the need for separate dedicated areas for each function and achieving high bandwidth within limited space.
Data Source
AI summary
A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.