Honeycomb Conductive Feature Layout for High-Density IC Packaging
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Solution Overview
Problem
Existing integrated circuit packages face challenges in increasing data transfer density and bandwidth due to limitations in the arrangement and density of conductive features.
Innovation Solution
The use of a honeycomb pattern for conductive features such as bond pads, bumps, through-vias, and solder regions increases the density of these features per unit area, thereby enhancing signal communication bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional square or rectangular patterns are used for conductive features, then manufacturing is simpler, but the density of conductive features per unit area is lower
Solution Approach 1:
The patent applies asymmetry by transitioning from symmetric square/rectangular patterns to asymmetric hexagonal honeycomb patterns. This asymmetric geometry allows for higher density of conductive features within the same area while maintaining manufacturability through standard photolithography processes.
Solution Approach 2:
The patent utilizes dimensional optimization by arranging conductive features in a two-dimensional honeycomb lattice structure. This arrangement maximizes spatial utilization in the planar dimension, achieving higher feature density compared to conventional one-dimensional row/column arrangements or simple two-dimensional square grids.
2Quantity of substance
If the pitch of conductive features is increased to accommodate more features, then more functions can be integrated, but the area occupied by each feature increases
Solution Approach 1:
The honeycomb pattern serves multiple functions simultaneously: it provides a regular geometric structure for manufacturing alignment, maximizes feature density within available area, and maintains adequate spacing between features for signal integrity. This multi-functionality resolves the contradiction between increasing feature count and controlling individual feature area.
Solution Approach 2:
The patent changes the geometric parameter from square/rectangular to hexagonal configuration. This parameter change in the fundamental geometry allows for optimized packing density while maintaining manufacturable pitch dimensions, thereby increasing the number of features without proportionally increasing the area each feature occupies.
3Productivity
If more conductive features are added to increase bandwidth, then data transfer density improves, but the complexity of package design increases
Solution Approach 1:
The patent segments the conductive features into discrete, regularly spaced honeycomb units. This segmentation creates a modular pattern that can be systematically replicated across the package substrate, increasing data transfer density through multiple parallel communication paths while keeping individual unit complexity low and manageable.
Solution Approach 2:
The honeycomb pattern enables easy copying and replication of the same geometric unit across the entire package design. This copying approach allows systematic increase in feature count for higher bandwidth applications without proportionally increasing design complexity, as each additional feature follows the same standardized pattern.
Data Source
AI summary
A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.