Honeycomb Connector Layout for High-Density IC Packaging

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Solution Overview

Problem

Existing integrated circuit packages face challenges in increasing data transfer density and bandwidth due to limitations in the arrangement and density of conductive features.

Innovation Solution

The use of a honeycomb pattern for conductive features such as bond pads, bumps, through-vias, and electrical connectors increases the density of these features per unit area, thereby enhancing signal communication bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional square or grid patterns are used for conductive features, then manufacturing is simpler, but the density of conductive features per unit area is lower

Engineering Contradiction:
Improvedensity of conductive features per unit areaVSAvoidcomplexity of conductive feature arrangement
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from conventional two-dimensional square/grid patterns to a three-dimensional honeycomb pattern arrangement. This dimensional change in the geometric configuration allows conductive features to be packed more efficiently in space, achieving higher density per unit area while maintaining manufacturability through standardized formation processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the pitch of conductive features is increased to accommodate more features, then more functions can be integrated, but the area occupied by each feature increases

Engineering Contradiction:
Improvedata transfer densityVSAvoidarea per conductive feature
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent changes the geometric parameters of the conductive feature arrangement by adopting a honeycomb pattern with specific pitch relationships. The horizontal pitch is set to P and the vertical pitch to P×√3/2, optimizing the spatial utilization. This parameter optimization allows more conductive features to be packed into the same area without increasing the physical size of individual features, thereby increasing data transfer density

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250118694A1Honeycomb pattern for conductive features
Publication Date: 2025.04.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250118694A1 patent drawing
  • US20250118694A1 patent drawing
  • US20250118694A1 patent drawing

AI summary

A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.