Honeycomb Structure Forming Die Linear Slit Segmentation
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Solution Overview
Problem
Current methods for manufacturing honeycomb structure forming dies are costly and time-consuming, especially when producing dies with complex slit shapes or large sizes, as they require specialized electrodes and precise processing techniques, leading to issues with dimensional accuracy and versatility.
Innovation Solution
A manufacturing method involving the formation of linear slits on a die substrate, followed by the disposal of a slit sealing material to create kneaded material discharging portions and sealing portions, allowing for the extrusion of honeycomb structures with improved dimensional accuracy and reduced manufacturing time and cost, without the need for specialized electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discharge processing using specialized electrodes is used to form complex slit shapes in the die, then the dimensional accuracy and shape precision are improved, but the manufacturing cost and time increase significantly
Solution Approach 1:
The patent divides the die manufacturing process into two independent stages: (1) forming simple linear slits using cost-effective grind processing or wire discharge processing, and (2) forming the complex slit shape by removing specific portions of the linear slits. This segmentation allows each stage to use the most appropriate processing method, avoiding the need for expensive specialized electrodes while achieving the desired complex slit geometry.
Solution Approach 2:
The patent performs preliminary formation of linear slits that extend beyond the final required slit positions. These preliminary linear slits serve as a base structure from which portions are subsequently removed to create the final complex slit shape. This preliminary action simplifies the overall manufacturing process by using standard processing methods first, then making localized modifications.
2Manufacturing precision
If discharge processing with specialized electrodes is used to form complex slit shapes, then the shape precision is improved, but the manufacturing cost increases
Solution Approach 1:
The patent segments the slit formation process into two parts: forming linear slits using inexpensive grind processing or wire discharge processing, and then removing portions of these linear slits to create the complex final shape. This avoids the need for expensive specialized electrodes while maintaining shape precision through the removal process.
Solution Approach 2:
The patent uses conventional, inexpensive processing methods (grind processing or wire discharge processing with standard electrodes) to form the die structure, rather than investing in expensive specialized electrodes. The preliminary linear slits serve as a disposable intermediate structure that is later modified to achieve the final shape.
3Adaptability or versatility
If the die is made larger to accommodate complex slit shapes, then the functionality is improved, but the processing difficulty and cost increase
Solution Approach 1:
The patent applies segmentation by forming the die in two stages: first creating linear slits that span the entire die length using standard processing, then removing portions of these slits to create complex shapes. This approach makes large-die manufacturing feasible with conventional equipment, as each stage uses straightforward processing methods suitable for large components.
Solution Approach 2:
The patent performs preliminary formation of linear slits that are easier to create in large dies using standard grind processing or wire discharge processing. After this preliminary action, the complex shapes are achieved by removing portions of the linear slits, which is a simpler operation for large components than attempting to form complex shapes directly.
Data Source
AI summary
A manufacturing method of a honeycomb structure forming die includes a linear slit forming step of forming, in a kneaded material discharging surface of a die substrate, a plurality of linear slits which are straight from one end to the other end on the kneaded material discharging surface, a slit sealing material disposing step of disposing a slit sealing material in parts of the plurality of linear slits, and a back hole forming step of forming back holes to introduce a kneaded material, in a kneaded material introducing surface of the die substrate which is present on a side opposite to the kneaded material discharging surface.