Vertical Memory Contact Layout for Uniform Bit-Line Characteristics

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Solution Overview

Problem

As memory devices become more integrated and multifunctional, there is a need for improved electrical characteristics and higher integration levels, particularly in vertical memory devices where bit lines exhibit non-uniform electrical characteristics due to varying parasitic capacitances across channel structures.

Innovation Solution

A vertical memory device design featuring a honeycomb structure of channel structures with bit lines connected through contacts, where the layout of contacts in different sub-arrays is optimized to manage parasitic capacitances uniformly across bit lines, ensuring consistent electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If memory devices are made more integrated with higher capacity, then the integration level and capacity increase, but the electrical characteristics of bit lines become non-uniform due to varying parasitic capacitances

Engineering Contradiction:
Improveintegration levelVSAvoidelectrical characteristic uniformity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by differentiating contact layouts between first and second sub-arrays. Specifically, contacts in the first sub-array are arranged with different spacing patterns compared to contacts in the second sub-array, allowing each sub-array to have optimized local electrical characteristics that compensate for position-dependent parasitic capacitance variations across the integrated memory device.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The memory device is segmented into multiple sub-arrays (first sub-array and second sub-array) with distinct contact layouts. This segmentation allows independent optimization of electrical characteristics in different regions, addressing the non-uniformity issue that arises from high integration by treating different physical locations with different contact configurations.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If bit lines are connected to multiple channel structures, then the capacity increases, but parasitic capacitances vary across bit lines causing non-uniform electrical characteristics

Engineering Contradiction:
ImprovecapacityVSAvoidelectrical characteristic uniformity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

Different sub-arrays have locally optimized contact layouts tailored to their specific positions and channel structure configurations. The first sub-array uses a contact layout optimized for its particular set of channel structures, while the second sub-array uses a different layout optimized for its channel structures, ensuring uniform electrical characteristics across all bit lines despite connecting to multiple channel structures.

Inventive Principle:
Principle #3Local quality

3Reliability

If contact layouts are optimized for uniform electrical characteristics, then bit line uniformity improves, but device complexity increases due to different layouts in different sub-arrays

Engineering Contradiction:
Improveelectrical characteristic uniformityVSAvoidcontact layout complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The device is divided into sub-arrays with different contact layouts, which increases complexity. However, this segmentation is necessary to achieve uniform electrical characteristics across the entire device. The complexity is managed by systematically applying different predefined contact layout patterns to different sub-arrays based on their positions and channel structure configurations.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11830805B2Vertical memory device
Publication Date: 2023.11.28 SAMSUNG ELECTRONICS CO LTD
  • US11830805B2 patent drawing
  • US11830805B2 patent drawing
  • US11830805B2 patent drawing

AI summary

A vertical memory device includes a plurality of word lines on a substrate, a plurality of word line cut regions extending parallel to each other, a memory cell array comprising a plurality of channel structures extending on the substrate through the plurality of word lines and arranged in a honeycomb structure, a plurality of contacts on the plurality of channel structures, and a plurality of bit lines connected to the plurality of channel structures through the plurality of contacts. The memory cell array comprises a first sub-array and a second sub-array, which are defined by the plurality of word line cut regions and are connected to some identical bit lines from among the plurality of bit lines, and a layout of contacts in the first sub-array from among the plurality of contacts is different from a layout of contacts in the second sub-array from among the plurality of contacts.