Hook-Shaped Memory Device Carrier Mounting
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Solution Overview
Problem
Current memory devices in compact form factors, such as 1U memory modules, face challenges in efficient component placement and signal routing due to the presence of fasteners near the connector end, which limits their deployment in smaller spaces and hinders easy replacement.
Innovation Solution
The development of carriers with engagement structures that allow memory devices to be securely and easily installed, removed, and replaced in server or computer system housings, facilitating plug-and-play deployment and efficient use of circuitry within constrained form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fasteners are used to secure memory devices in compact form factors, then the memory devices can be securely mounted, but the fasteners near the connector end limit efficient component placement and signal routing
Solution Approach 1:
The memory device is divided into distinct functional zones: a connector end zone for electrical connections and a mounting zone for fasteners. This segmentation allows the fasteners to be positioned away from the connector end, eliminating interference with signal routing while maintaining secure mounting capability.
Solution Approach 2:
The fasteners are repositioned from a planar arrangement near the connector end to a three-dimensional configuration in the mounting zone. This dimensional relocation allows secure attachment without compromising the electrical connection area or signal routing efficiency.
2Reliability
If fasteners are positioned near the connector end for secure mounting, then the memory device can be firmly attached, but replacement becomes difficult and time-consuming
Solution Approach 1:
The mounting mechanism is segmented into independent fastener elements positioned in a dedicated mounting zone. This segmentation allows each fastener to be independently accessed and manipulated, enabling quick release and replacement without requiring disassembly of the entire device or careful manipulation of fasteners near the connector.
Solution Approach 2:
The fasteners are pre-positioned in the mounting zone during manufacturing, creating a ready-to-release configuration. This preliminary arrangement allows for rapid replacement operations by simply engaging or disengaging the fasteners in the pre-configured mounting zone, without requiring complex alignment or manipulation during replacement.
3Volume of moving object
If memory devices are designed in compact form factors to fit smaller spaces, then more memory can be deployed in servers, but component placement and signal routing become more difficult
Solution Approach 1:
The compact memory device is segmented into distinct functional zones: a connector end zone for electrical connections and a mounting zone for fasteners. This segmentation allows efficient use of limited space while maintaining clear pathways for signal routing, as the zones are spatially separated to avoid interference.
Solution Approach 2:
The fasteners are repositioned from a planar arrangement that would interfere with signal routing to a three-dimensional configuration in the mounting zone. This dimensional change allows the compact form factor to accommodate both secure mounting and efficient signal routing without increasing the overall device footprint.
Data Source
AI summary
Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface located proximate to an end of the substrate and sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device. Hook-shaped engagement structures may be located proximate to, and laterally outward from, the interface, the engagement structures extending laterally beyond a longitudinal remainder of a lateral periphery of the substrate trailing the engagement structures. The end of the substrate may lack screw keep-outs. A carrier may include posts shaped, positioned, and configured to be positioned in throats of the hook-shaped engagement structures to secure the end of the substrate to the carrier. Sidewalls may extend longitudinally from a crossbar for placement along the remainder of the lateral periphery of the substrate.