Horizontal Coil Inductor Layout for Stable Package Integration
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Solution Overview
Problem
The integration of inductors and capacitors into device packages faces challenges due to complex manufacturing processes and structural instability, leading to low yield and potential malfunctions caused by fragile pillars used in coil construction.
Innovation Solution
The use of plate portions instead of pillars to form a coil concentric to a horizontal axis, providing a more robust structure and simplifying the manufacturing process, while integrating the inductor and capacitor to share metal layers and reduce package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If pillars are used to construct the coil, then the inductor can be formed with vertical structure, but the manufacturing yield decreases and structural stability deteriorates due to fragile pillars
Solution Approach 1:
The patent inverts the conventional vertical pillar structure into a horizontal coil structure formed by planar conductive layers. Instead of building upward with vertical pillars, the coil is constructed by winding conductive traces in horizontal planes across multiple stacked layers, fundamentally changing the structural orientation to eliminate pillar fragility while maintaining inductor functionality
Solution Approach 2:
The patent replaces the mechanical pillar-based construction with an integrated planar circuit board structure. The coil is formed by conductive traces patterned on and between dielectric layers, eliminating the need for separate mechanical pillars and their associated assembly steps, thereby improving both structural integrity and manufacturing yield
2Adaptability or versatility
If separate inductor and capacitor components are used, then each component can be independently designed, but the device package size increases
Solution Approach 1:
The patent merges the inductor and capacitor into a single integrated structure where the capacitor is positioned at the center and the inductor coil surrounds it. Both components share common dielectric layers and conductive interconnections, allowing independent electrical design while occupying a unified physical footprint that reduces overall package size
Solution Approach 2:
The patent implements a nested configuration where the capacitor structure is positioned at the core and the inductor coil is wound around it in concentric fashion. This nested arrangement allows both components to occupy overlapping three-dimensional space, maximizing space utilization and minimizing the external dimensions of the device package
3Adaptability or versatility
If complex manufacturing processes are used for integration, then inductor and capacitor can be integrated, but the manufacturing complexity increases and yield decreases
Solution Approach 1:
The patent employs universal planar fabrication techniques for both inductor and capacitor formation, using the same dielectric layer deposition, conductive trace patterning, and layer stacking processes. This multi-functional approach allows both components to be manufactured through identical standard工艺流程, eliminating the need for specialized manufacturing steps and simplifying the overall production process
Solution Approach 2:
The patent performs preliminary patterning of conductive layers and dielectric structures during the standard PCB fabrication sequence before final assembly. The inductor traces and capacitor plates are pre-formed in the layered structure during lamination and routing operations, eliminating subsequent complex assembly steps and reducing manufacturing complexity
Data Source
AI summary
An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.