Horizontal Connector Terminal Layout for Better Signal Integrity

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Solution Overview

Problem

Conventional connectors face challenges in achieving high Signal Integrity (SI) performance due to high design and manufacturing costs, complex processes, and poor product qualification rates, despite optimization methods like shielding and filtering.

Innovation Solution

A horizontal connector design featuring a casing with card slots, terminal components with specific structural optimizations, including serrated inserting holes, symmetrical signal terminals, and rear stoppers, which improve characteristic impedance and SI performance while reducing manufacturing costs and simplifying the production process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If shielding shells, welding, conductive plastics are added to optimize SI performance, then electrical and signal integrity performance is improved, but design and manufacturing costs increase, processes become complicated, production duration increases and product qualification rates decrease

Engineering Contradiction:
ImproveSI performanceVSAvoiddesign and manufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the need for external shielding shells and complex conductive plastic structures by integrating electromagnetic shielding functionality directly into the terminal component structure through optimized ground terminal arrangements and casing design, thereby simplifying the overall device while maintaining SI performance

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines multiple functions into the terminal components themselves - the terminal components serve both as electrical connectors and as electromagnetic shielding elements through their ground terminals and positioning structures, eliminating the need for separate shielding components

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If shielding shells, welding, conductive plastics are added to optimize SI performance, then electrical and signal integrity performance is improved, but manufacturing costs increase

Engineering Contradiction:
ImproveSI performanceVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses standard, easily manufactured terminal components with integrated ground terminals rather than expensive custom shielding structures, achieving cost-effective SI optimization through conventional manufacturing processes

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent optimizes SI performance by adjusting geometric parameters of the terminal components - such as ground terminal width, spacing, and positioning - rather than adding expensive materials or complex structures, thereby reducing manufacturing costs while improving performance

Inventive Principle:
Principle #35Parameter changes

3Reliability

If shielding shells, welding, conductive plastics are added to optimize SI performance, then electrical and signal integrity performance is improved, but production duration increases

Engineering Contradiction:
ImproveSI performanceVSAvoidproduction duration
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent incorporates electromagnetic shielding functionality into the terminal components during the initial molding process, rather than requiring subsequent assembly steps with separate shielding components, thereby reducing production duration while maintaining SI performance

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20240413585A1Horizontal Connector
Publication Date: 2024.12.12 SHENZHEN GLGNET ELECTRONICS
  • US20240413585A1 patent drawing
  • US20240413585A1 patent drawing
  • US20240413585A1 patent drawing

AI summary

The present invention relates to a horizontal connector comprising a casing and several terminal components; the casing is provided with card slots for inserting terminal components and AICs; the terminal components comprise terminal groups and molded parts; the terminal groups comprise ground terminals, first signal terminals and second signal terminals; the casing is uniformly provided with first openings corresponding to terminal heads; the casing is uniformly provided with second openings corresponding to the force arm area of ground terminals; the first openings are provided with serrated inserting holes for limiting the height of terminal heads. By changing the casing structure and optimizing the terminal structure, the characteristic impedance of the terminal groups can be directly optimized and the SI performance of horizontal connectors can be effectively improved, reducing the manufacturing cost for conventional SI performance optimization solutions, simplifying the process, shortening the production time and improving the product qualification rate.