Horizontally Configured Connector Vertical Stacking
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Solution Overview
Problem
Existing I/O connectors face challenges in increasing density without increasing width, which leads to signal degradation due to reduced electrical separation at higher frequencies, and require improved manufacturing processes to accommodate higher signaling frequencies while maintaining compactness.
Innovation Solution
A connector design featuring a housing with multiple circuit cards arranged in vertical stacks, allowing for increased density without widening the connector, using a combination of swageable and collar-based fastening mechanisms to securely hold the housing pieces together, enabling a ganged or tandem configuration without increasing the overall width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the connector width is increased to accommodate more circuits, then the connector density is improved, but the compatibility with standard width routers and servers deteriorates
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of circuit cards, utilizing the vertical dimension to increase connector density without expanding the horizontal width. This allows the connector to maintain compatibility with standard equipment while accommodating more circuits through multi-layer vertical configuration.
Solution Approach 2:
The connector is divided into multiple separate housing members that can be assembled together horizontally. This segmentation allows the connector to be constructed in a modular fashion, maintaining a compact width profile while integrating multiple circuit cards vertically within the segmented housing structure.
2Quantity of substance
If the terminals are brought closer together to increase density, then the connector compactness is improved, but the electrical separation between terminals deteriorates
Solution Approach 1:
By stacking circuit cards vertically in multiple layers, the patent achieves higher terminal density without reducing the horizontal electrical separation between terminals on the same card. The vertical arrangement allows terminals to be closely packed in the Z-dimension while maintaining adequate spacing in the XY-plane for high-frequency signal integrity.
Solution Approach 2:
Multiple circuit cards are nested vertically within the housing, with each card containing terminals that are electrically separated from terminals on adjacent cards through the housing structure. This nesting arrangement increases overall connector density while preserving electrical isolation between terminal groups.
3Quantity of substance
If the connector width is increased to accommodate more circuits, then the connector density is improved, but the manufacturing complexity increases
Solution Approach 1:
The housing is segmented into multiple separate members that can be manufactured independently using standard manufacturing processes. This segmentation reduces the complexity of manufacturing a single large-width connector while achieving equivalent density through vertical stacking and modular assembly of the segmented components.
Data Source
AI summary
A connector includes at least a pair of mating portions and each mating portion includes a at least one mating blade. The connector body has a height that is greater than twice a height of the mating portion. Flanges can be provided on both sides of the mating blade.