Horizontal Electroplating Apparatus with Movable Anode
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The vertical plating method in electroplating faces challenges such as non-uniform resistance of the seed pattern, accumulation of gases and by-products, and a bulky plating system, making it difficult to achieve uniform plating and efficient processing.
Innovation Solution
A horizontal electroplating apparatus with multiple cathodes on both sides of the substrate and a movable anode above, allowing for uniform current distribution and reduced accumulation of obstacles, enabling precise control of current density and plating thickness across different regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vertical plating method is used, then substrate can be loaded into plating bath, but resistance of seed pattern increases away from contact portion making uniform plating difficult
Solution Approach 1:
The patent inverts the conventional vertical plating configuration by placing the substrate horizontally at the bottom of the plating bath and positioning the cathode above the substrate. This inversion allows the cathode to contact the seed pattern at multiple points across its entire surface, ensuring uniform resistance distribution and enabling formation of uniform plating layers throughout the substrate area.
2Productivity
If vertical plating method is used, then plating can be performed, but gases and by-products accumulate in vertical direction creating obstacles to plating
Solution Approach 1:
The patent changes the plating configuration from vertical to horizontal orientation. By placing the substrate horizontally and the cathode above it, the system allows gases and by-products to be discharged laterally along the horizontal direction rather than accumulating vertically, thereby eliminating plating obstacles and improving process efficiency.
3Productivity
If vertical plating method is used, then substrate can be plated, but plating bath and peripheral devices become bulky due to rotation requirements
Solution Approach 1:
The patent inverts the conventional vertical plating setup to a horizontal configuration where the substrate remains horizontal throughout the plating process. This eliminates the need for substrate rotation mechanisms and reduces the overall system volume, making the plating bath and peripheral devices more compact while maintaining full substrate processing capability.
4Manufacturing precision
If multiple cathodes are added on both sides of substrate, then current distribution becomes uniform, but device complexity increases
Solution Approach 1:
The patent divides the cathode into multiple segments positioned on both sides of the substrate. This segmentation allows each cathode portion to independently contact and deliver current to different regions of the seed pattern, ensuring uniform current distribution across the entire substrate while maintaining a manageable and organized device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The horizontal electroplating method ensures a uniform plating layer with consistent resistance and reduced by-product accumulation, improving the efficiency and compactness of the plating system, allowing for precise control of current density and plating thickness.
Implementation Method 1
electroplating apparatus and electroplating method using the same
Implementation Method 2
giving the surfaces of materials and parts functional properties such as corrosion resistance, durability, and conductivity or improving the appearance through physical, chemical, and electrochemical treatments
Data Source
AI summary
An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.