Horizontal MEMS Switch Noise Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing MEMS switches lack superior noise isolation in their off-state and have complex manufacturing processes, which increase costs.
Innovation Solution
A horizontal micro-electro-mechanical-system (MEMS) switch is integrated into semiconductor devices, featuring a conductive cantilever, plate, and actuator formed within dielectric material layers, with a simplified manufacturing process that includes forming trenches and filling them with conductive material, and laterally undercutting the dielectric layers to create a cavity for mechanical contact under electrical bias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional transistor-based electronic switches are used, then device integration is simple, but noise isolation in off-state is insufficient
Solution Approach 1:
The switch is segmented into distinct mechanical components (cantilever, plate, actuator) that can be independently controlled and positioned, allowing for superior noise isolation through physical separation of conductive paths in the off-state while maintaining manageable manufacturing complexity through modular construction
2Reliability
If complex manufacturing processes are used for MEMS switches, then device performance is improved, but manufacturing cost increases
Solution Approach 1:
Multiple conductive portions are merged into a single conductive layer formed at the same level, allowing simultaneous formation of cantilever, plate, and actuator structures in one manufacturing step rather than requiring separate complex processes for each component, thereby reducing manufacturing cost while maintaining device reliability
Solution Approach 2:
The conductive material layer serves multiple functions simultaneously - forming the cantilever structure, the plate structure, and the actuator structure - allowing a single manufacturing process to create multiple critical components, simplifying the overall manufacturing process while ensuring consistent performance
3Ease of manufacture
If conductive portions are formed at different levels, then device functionality is achieved, but manufacturing process becomes complex and costly
Solution Approach 1:
The conductive portions are arranged in the horizontal plane at the same level rather than stacked vertically at different levels, transforming a vertical multi-layer structure into a horizontal single-layer structure, which simplifies manufacturing by eliminating the need for multiple alignment and deposition steps while achieving the required device functionality through lateral positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS switch provides superior noise isolation in its off-state and simplifies the manufacturing process, reducing costs by forming conductive portions at the same level, enhancing signal path functionality.
Implementation Method 1
the free end of the conductive cantilever is laterally flexible to enable mechanical contact with the conductive plate under electrical bias applied across the conductive actuator and the conductive cantilever
Data Source
AI summary
A first dielectric material layer and a second dielectric material layer are formed on a substrate. Three conductive portions are formed within the second dielectric material layer. An optional third dielectric material layer and an optional dielectric capping layer may be formed over the three conductive portions. Portions of the second dielectric material layer and the first dielectric material layer are removed from within an area of a hole in a masking layer. The first dielectric material layer is laterally undercut to provide a micro-electro-mechanical-system (MEMS) switch comprising a conductive cantilever, a conductive plate, and a conductive actuator from the three conductive portions as portions of the first and second dielectric material layers are removed. The MEMS switch may be employed to provide mechanical switchable contact between the conductive cantilever and the conductive plate through an electrical signal on the conductive actuator.