Horizontal Nozzle Compression Molding for Electronic Components

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Solution Overview

Problem

The existing compression molding techniques for electronic components face challenges in downsizing the apparatus and ensuring homogeneous resin supply, leading to increased size, reduced yield, and quality issues due to incomplete resin curing and deformation.

Innovation Solution

A compression molding method and apparatus where liquid resin is discharged horizontally into the cavity, allowing for a smaller apparatus design and improved resin distribution, ensuring complete curing and reducing deformation by using a horizontal nozzle and measuring mechanism to supply and mix the resin effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a vertical dispenser is used to supply liquid resin into the cavity, then the resin can be supplied vertically, but the distance between the molding surfaces must be increased to accommodate the vertical dispenser, resulting in increased apparatus size

Engineering Contradiction:

Improveapparatus sizeVSAvoidmold assembly structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent inverts the conventional vertical resin supply approach by using a horizontal nozzle to supply liquid resin horizontally into the cavity. This inversion eliminates the need for a vertical dispenser extending between molding surfaces, thereby reducing apparatus size while maintaining effective resin supply to the cavity.

Inventive Principle:

Principle #13The other way round (Inversion)

2Manufacturing precision

If liquid resin is supplied vertically from a vertical dispenser, then the resin flows into the cavity, but the resin may gel or cure before complete supply due to heating, causing non-homogeneous distribution and convex formation

Engineering Contradiction:

Improveresin distribution uniformityVSAvoidcuring completeness

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the resin supply direction from vertical to horizontal. The horizontal nozzle supplies resin along the cavity length, allowing gravity to assist downward flow into the cavity while reducing exposure time to heating sources. This directional change prevents premature curing and ensures homogeneous resin distribution throughout the cavity.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The horizontal nozzle is positioned to supply resin at the beginning of the cavity, allowing the resin to flow forward before the cavity is fully heated. This preliminary supply action ensures complete resin coverage before curing begins, preventing convex formations and unloaded portions.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If liquid resin is supplied in insufficient volume or non-homogeneously, then the cavity is not fully filled, but unloaded portions are formed in the LED moldings, reducing product quality

Engineering Contradiction:

Improvemolding qualityVSAvoidresin volume

Core Design Contradiction:

Manufacturing precisionVSQuantity of substance

Solution Approach 1:

By supplying resin horizontally from a horizontal nozzle, the resin flows more efficiently along the cavity length and distributes uniformly across the cavity width. This horizontal supply method ensures complete cavity filling with the required resin volume, eliminating unloaded portions and improving molding quality.

Inventive Principle:

Principle #13The other way round (Inversion)

4Reliability

If the cavity is heated before complete resin supply, then the resin begins to cure, but cured resin may move in liquid resin and deform or cut wires, reducing yield

Engineering Contradiction:

Improvewire integrityVSAvoidcavity temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The horizontal resin supply approach allows resin to be introduced into the cavity before significant heating occurs. The resin flows horizontally and fills the cavity from the supply end, ensuring complete coverage of electronic components and wires before curing begins. This sequence prevents cured resin movement that could damage wires.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables downsizing of the compression molding apparatus while improving the yield and quality of electronic component moldings by ensuring homogeneous resin supply and complete curing, reducing the formation of unloaded portions and deformations.

Implementation Method 1

liquid resin is discharged in the horizontal direction, so that the liquid resin falls into the cavity

Methodology Applied

Scientific EffectGravity: Gravitation

Implementation Method 2

After a lapse of a time necessary for curing liquid resin 87

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS8684718B2Compression molding method for electronic component and compression molding apparatus employed therefor

Publication Date: 2014.04.01 TOWA

AI summary

First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.