Horizontal-Stack Spectral Imager for Cryogen-Free Methane Detection

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Solution Overview

Problem

Conventional infrared spectral imagers face challenges such as high cost, limited scalability, reliance on expensive and brittle optics, need for cryogenic systems, and suboptimal sensitivity due to vertical stack architectures, which hinder their widespread use in applications like methane gas leak detection.

Innovation Solution

A sensor device with a horizontal stack configuration, comprising a readout integrated circuit, electrical contacts, a solution-processed layer, and a spectral band filter layer, which allows for selective wavelength propagation and eliminates the need for cryogenic systems, enabling scalable manufacturing and improved sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional infrared spectral imagers use vertical stack architectures with hybridization devices, then gas detection capability is achieved, but device complexity and manufacturing cost increase significantly

Engineering Contradiction:
Improvegas detection capabilityVSAvoidvertical stack architecture complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent transitions from a vertical stack architecture to a horizontal stack architecture, fundamentally changing the spatial arrangement of layers. This dimensional change allows the spectral imager to achieve gas detection capability while reducing device complexity and manufacturing cost by eliminating the need for complex hybridization devices and cryogenic systems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the spectral imager into distinct functional layers (readout integrated circuit layer, photodetector layer, spectral band filter layer) that can be independently fabricated and then stacked horizontally. This segmentation enables simplified manufacturing of each layer while maintaining overall device functionality, reducing the complexity associated with conventional integrated approaches.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If conventional infrared spectral imagers use cryogenic systems, then signal-to-noise performance is improved, but device size, weight, power consumption and cost increase

Engineering Contradiction:
Improvesignal-to-noise performanceVSAvoiddevice weight
Core Design Contradiction:
Measurement precisionVSWeight of moving object

Solution Approach 1:

The patent extracts and removes the cryogenic system from the spectral imager design. By taking out this complex and heavy component, the device weight, power consumption, and cost are significantly reduced while maintaining acceptable signal-to-noise performance through alternative approaches in the horizontal stack architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces expensive, complex cryogenic systems with more affordable, solid-state components in the horizontal stack architecture. The readout integrated circuit and photodetector layers can be fabricated using standard semiconductor processes, eliminating the need for expensive cryogenic equipment while maintaining detection functionality.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Measurement precision

If conventional infrared spectral imagers use expensive optics like CaF2 or KBr, then optical performance is achieved, but manufacturing difficulty and cost increase

Engineering Contradiction:
Improveoptical performanceVSAvoidoptical manufacturing difficulty
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent replaces expensive, difficult-to-manufacture optics like CaF2 and KBr with standard semiconductor materials and solution-processed layers. The spectral band filter layer can be deposited using conventional semiconductor fabrication techniques, significantly easing manufacturing while maintaining optical performance for gas detection.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameters and fabrication methods from conventional optical materials to semiconductor-compatible materials. This parameter change enables the use of standard manufacturing processes while achieving the required optical performance for detecting gases like methane in the horizontal stack architecture.

Inventive Principle:
Principle #35Parameter changes

4Productivity

If conventional spectral imagers use broad spectral resolution, then optical throughput is improved, but gas identification capability deteriorates

Engineering Contradiction:
Improveoptical throughputVSAvoidgas identification capability
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent applies local quality by using spectral band filter layers with specific wavelength ranges tailored to detect particular gases. Each layer can be optimized for its specific detection target, allowing the system to maintain high optical throughput while achieving the spectral resolution needed for accurate gas identification through localized spectral filtering.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables cost-effective, scalable, and sensitive infrared imaging capable of detecting gases like methane without cryogenic systems, with enhanced sensitivity and reduced noise performance, suitable for applications like methane gas leak detection.

Implementation Method 1

a spectral band filter layer deposited on top of the solution processed layer, wherein the spectral band filter layer is optically aligned with the solution processed layer

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

a solution processed layer deposited on top of the array of electrical contacts

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS20250377243A1Spectral imaging system, method of fabricating thereof and camera device
Publication Date: 2025.12.11 QUANTUM DEVICES CORP
  • US20250377243A1 patent drawing
  • US20250377243A1 patent drawing
  • US20250377243A1 patent drawing

AI summary

Various embodiments are described herein for a sensor device, a method of manufacturing said sensor device, and a camera device constructed using said sensor device. The sensor device includes: a readout integrated circuit; an array of electrical contacts mounted to the readout integrated circuit; a solution processed layer deposited on top of the array of electrical contacts; and a spectral band filter layer deposited on top of the solution processed layer, wherein the spectral band filter layer is optically aligned with the solution processed layer and wherein the readout integrated circuit, the array of electrical contacts and the solution processed layer form together a focal plane array for receiving light from a lens device.