Horizontal Subrack Ventilation Layout for Even Board Cooling
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Solution Overview
Problem
The existing horizontal subracks in electronic and communication equipment suffer from inadequate air volume distribution due to direct airflow from axial flow fans, leading to uneven cooling and limited heat dissipation capability.
Innovation Solution
The design incorporates a ventilation box with an air partition plate that divides it into an air-in chamber and an air-out chamber, with the fan box located within the air-in chamber and air inlets/outlets positioned accordingly, along with air-in and air-out ducts on either side of the board slots, to extend the airflow path and ensure even air distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an axial flow fan is used to dissipate heat in a horizontal subrack with limited widthwise dimension, then heat dissipation function is provided, but the cool air is not mixed sufficiently before arriving at the board area, resulting in uneven air volume distribution
Solution Approach 1:
The ventilation box is segmented into an air-in chamber and an air-out chamber by an air partition plate. The fan box is positioned within the air-in chamber, separating the fan assembly from the board area. This segmentation allows cool air to be introduced and mixed in the air-in chamber before being distributed through air-in ducts to multiple board slots, achieving both effective heat dissipation and even air volume distribution across all boards.
2Volume of moving object
If the fan box is positioned directly adjacent to the board area, then the structure is compact, but the fan hub directly impacts airflow, preventing sufficient mixing and reducing air volume evenness
Solution Approach 1:
The fan box is nested within the air-in chamber of the ventilation box, which itself is positioned above or below the board area. This nested arrangement allows the fan assembly to be integrated into the ventilation structure without increasing the overall footprint, while the air partition plate ensures that the fan hub does not directly obstruct airflow to the boards, maintaining both compactness and air distribution evenness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the impact of the fan hub on airflow and ensures even air volume allocation to board slots, enhancing the heat dissipation capability of the horizontal subrack.
Implementation Method 1
the axial flow fan, the airflow enters the board area 14 to dissipate heat for the boards
Implementation Method 2
The air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber
Implementation Method 3
the airflow enters the board area 14 to dissipate heat for the boards in the board area 14
Data Source
AI summary
A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber. The horizontal subrack extends the trail between the fan box and the board area, improves the evenness of the air volume distributed to the slots of the horizontal subrack, and overcomes the bottleneck of enhancing the heat dissipation capability of the horizontal subrack.