Horizontal Multi-Chamber Substrate Processing System
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor substrate processing systems with multiple chambers face constraints in throughput due to the bulkiness of the systems and the need to move substrates within them, limiting the efficiency of processing multiple substrates simultaneously.
Innovation Solution
A semiconductor processing system with horizontally-oriented process module assemblies, each comprising a central transfer chamber with process modules arranged around it, allowing for efficient loading and unloading sequences and increased throughput by reducing the distance and number of substrate handling robots required, and enabling more process modules to be added within the same clean room space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple process chambers are used to process multiple substrates simultaneously, then substrate processing throughput is improved, but system bulkiness and substrate handling distance increase
Solution Approach 1:
The patent transitions from a vertical stacking arrangement to a horizontal linear arrangement of process chambers. This dimensional change allows multiple chambers to be accessed efficiently without requiring complex vertical movement mechanisms, reducing overall system bulkiness while maintaining high throughput capability for processing multiple substrates simultaneously
2Productivity
If multiple process chambers are used to process multiple substrates simultaneously, then substrate processing throughput is improved, but substrate handling distance and time increase
Solution Approach 1:
By arranging process chambers in a horizontal linear configuration rather than vertical stacking, the patent reduces the distance substrates must be transported between chambers. This dimensional reorganization allows for more efficient substrate handling paths while maintaining the capability to process multiple substrates in parallel across different chambers
3Area of stationary object
If process modules are arranged vertically, then system footprint is reduced, but accessibility and ease of operation deteriorate
Solution Approach 1:
The patent inverts the conventional vertical arrangement of process modules by implementing a horizontal linear configuration. This inversion improves accessibility and ease of operation, as horizontal arrangements allow for better robot arm access and simpler maintenance pathways, while the linear layout optimizes the use of clean room space along the horizontal dimension rather than consuming vertical space
Data Source
AI summary
A semiconductor processing system comprises a first, a second, and a third process module assembly. The third process module assembly is between the first and the second process module assemblies, and includes an opening for providing substrates to be processed in the various process module assemblies. The process modules are arranged laterally relative to the opening. The first and second process module assemblies each include an associated transfer chamber, an associated substrate transfer device, and a plurality of associated process modules attached the associated transfer chamber. The third process module assembly may include an associated transfer chamber, an associated substrate transfer device, and a single associated process module attached to the associated transfer chamber. The processing system is configured to sequentially load substrates into the process module assemblies neighboring the third process module assembly, and lastly load substrates into the process module of the third process module assembly.