Horizontal Wire Bond Interconnection for Compact Microelectronic Packages

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Solution Overview

Problem

Conventional microelectronic packages face challenges in compactness due to limited headroom and floor space in low-profile applications such as mobile phones and electronic tablets, necessitating a more compact design for interconnection.

Innovation Solution

The design incorporates wire bond wires that laterally jut out from the substrate's surface for a specific distance, allowing for horizontal extension and co-planarity within a defined angle, enabling efficient interconnection while minimizing package height and footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If conventional vertical wire bond interconnection is used, then electrical connectivity is achieved, but package height increases

Engineering Contradiction:

Improvepackage heightVSAvoidelectrical interconnection reliability

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent transitions from vertical wire bond interconnection to horizontal surface interconnection, changing the spatial dimension of electrical connectivity. Wire bonds are extended laterally along the substrate surface rather than vertically, thereby reducing package height while maintaining electrical connection functionality between ICs and circuit platform.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If larger bond pads are used for wire bond attachment, then bonding reliability improves, but floor space increases

Engineering Contradiction:

Improvebonding reliabilityVSAvoidfloor space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent implements redistribution layers (RDLs) that concentrate bond pads in specific localized regions rather than distributing them across the entire IC surface. This allows wire bonds to be attached at optimized locations with sufficient pad size for reliable bonding, while minimizing the overall floor space required for interconnection structures.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS10008534B2Microelectronic package with horizontal and vertical interconnections

Publication Date: 2018.06.26 EMC IP HLDG CO LLC

AI summary

In a microelectronic package, a first wire bond wire is coupled to an upper surface of a substrate. A first bond mass is coupled to another end of the first wire bond wire. A second wire bond wire is coupled to the upper surface. A second bond mass is coupled to another end of the second wire bond wire. The first and second wire bond wires laterally jut out horizontally away from the upper surface of the substrate for at least a distance of approximately 2 to 3 times a diameter of both the first wire bond wire and the second wire bond wire. The first wire bond wire and the second wire bond wire are horizontal for the distance with respect to being co-planar with the upper surface within +/−10 degrees.