Horseshoe Spring Clip for Optical Subassembly Stress Relief
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Solution Overview
Problem
Existing optical transceiver modules face challenges in securely interconnecting optical subassemblies with printed circuit boards without imposing undue stress or strain, which can lead to breakage or misalignment, and require a solution that meets standard form factors and prevents electromagnetic interference.
Innovation Solution
A spring clip system with a U-shaped configuration is used to secure the optical subassembly's nosepiece within a shell, providing a resilient force to maintain proper orientation and thermal contact while allowing for limited repositioning to prevent stress and enhance electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical subassembly is rigidly fixed to the printed circuit board, then the electrical connection is secure, but stress and strain are imposed on the interconnection components leading to breakage or misalignment
Solution Approach 1:
The patent employs a flexible printed circuit board (FPCB) instead of a rigid PCB to connect the optical subassembly. The FPCB can bend and deform to accommodate misalignments and stress without breaking, thus maintaining secure electrical connection while protecting the interconnection components from damage due to rigid constraints
Solution Approach 2:
The patent changes the mechanical parameters of the circuit board from rigid to flexible by using FPCB material and construction. This parameter change allows the board to adapt its shape and absorb stress, preventing breakage of interconnection components while maintaining reliable electrical connection
2Reliability
If the optical subassembly is securely interconnected within the transceiver module, then the connection stability is improved, but the module size increases reducing port density
Solution Approach 1:
The patent integrates the optical subassembly directly into the transceiver module housing in a nested configuration, where the subassembly fits within the available space of the module shell. This nesting approach maximizes space utilization, maintaining secure connection while minimizing overall module volume to increase port density
3Measurement precision
If the optical subassembly is positioned for precise alignment, then the optical performance is improved, but the positioning complexity increases
Solution Approach 1:
The patent employs a self-aligning mechanism where the optical subassembly automatically positions itself relative to the transceiver components through built-in mechanical features such as guide pins, alignment slots, or compliant mounting structures. This self-service approach achieves precise optical alignment without requiring complex external positioning devices or manual adjustment mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spring clip system effectively reduces stress on optical subassembly components during interconnection, ensures secure and stable positioning, and enhances thermal contact, while also reducing electromagnetic interference, thus improving the reliability and performance of optical transceiver modules.
Implementation Method 1
The head portion is shaped so as to provide a resilient force against a flange of the nosepiece
Implementation Method 2
The system reduces stress imposed on a hermetic package of the optical subassembly during lead interconnection procedures
Data Source
AI summary
A system for retaining an optical subassembly in a shell of a communications module is disclosed. The system reduces stress imposed on a hermetic package of the optical subassembly during lead interconnection procedures while ensuring thermal contact of the package with a thermal pad mounted in the shell. In one embodiment, the system includes a spring clip comprising a head portion that defines a seating surface, as well as first and second arms. The seating surface is shaped to engage an outer surface of a nosepiece of the optical subassembly. The first and second arms extend from the head portion so as to define a “U”-shaped configuration with the head portion. The head portion is shaped so as to provide a resilient force against a flange of the nosepiece when the flange and spring clip are received in a groove defined in the shell during assembly.