Host Circuit Card Heating for Cold-Start Storage Devices
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Solution Overview
Problem
Computing devices face operational challenges due to thermal limitations, particularly in extreme ambient temperatures, which can impair the performance and functionality of hardware components.
Innovation Solution
Integration of heating assemblies with host circuit cards to establish thermal conduction paths for hardware components, allowing active warming to maintain temperatures within thermal operating ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating assemblies are integrated with host circuit cards to warm hardware components, then the operating temperature range of storage devices is improved, but the device complexity increases
Solution Approach 1:
The heating assembly is integrated with the host circuit card, combining the storage device host interface and heating functionality into a single unit. This allows the heating function to be provided without adding a separate, independent heating device, thereby limiting the increase in device complexity while still improving the operating temperature range.
Solution Approach 2:
The host circuit card serves multiple functions: it provides the storage device host interface for data communication and simultaneously functions as a heating assembly to warm the storage device. This multi-functionality allows temperature control without requiring a dedicated single-function heating device, resolving the contradiction between temperature range improvement and device complexity.
2Reliability
If thermal conduction paths are established between heating assemblies and storage devices, then the reliability of hardware components in cold environments is improved, but the device complexity increases
Solution Approach 1:
The thermal conduction path is established through the integrated host circuit card, which combines the interface function and heating function. This merging approach ensures reliable thermal conduction from the heating assembly to the storage device without requiring separate thermal management components, thereby improving reliability in cold environments while limiting the increase in device complexity.
3Adaptability or versatility
If heating assemblies are positioned between host circuit cards and storage devices, then the adaptability to extreme ambient temperatures is improved, but the device complexity increases
Solution Approach 1:
The host circuit card is designed to simultaneously serve as both the interface card and the heating assembly. This integration allows the system to adapt to extreme ambient temperatures by providing heating capability without adding a separate heating device, thereby improving adaptability while limiting the increase in device complexity.
Solution Approach 2:
The host circuit card performs multiple functions including data communication interface and thermal management through integrated heating. This multi-functionality enables the system to adapt to varying environmental conditions without requiring additional specialized components, resolving the contradiction between adaptability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the likelihood of computing devices providing computer-implemented services across a wider range of environmental conditions by mitigating the impact of cold temperatures on hardware components.
Implementation Method 1
a heating assembly positioned on the host circuit card and with the edge connector to be between the host circuit card and the storage device while the edge connector is connected to the edge connector receptacle, the heating assembly being adapted to: monitor a temperature of the hardware component, and selectively generate heat to warm the hardware component substantially by conduction heating
Data Source
AI summary
Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.