Hot-Bath Wafer Separation for Low-Load Bonded Wafer Peeling
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Solution Overview
Problem
The existing methods for peeling off bonded wafers in semiconductor manufacturing are mechanically intensive, which can cause damage and reduce yield, especially when trying to separate wafers with three-dimensional memory cell arrays.
Innovation Solution
A manufacturing apparatus and method that uses a hot bath with a boiling liquid to apply pressure and utilize thermal expansion to gently separate the wafers with minimal mechanical load, employing an upper arm to apply pressure and a transfer unit to position and handle the wafers accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical peeling method is used to separate bonded wafers, then the separation can be achieved, but the mechanical load causes damage and reduces yield
Solution Approach 1:
The patent replaces the mechanical peeling system with a thermal system. A hot bath heats the bonded wafers to a temperature where the bonding material softens or melts, allowing the wafers to separate without mechanical force. This substitution eliminates the damaging mechanical load while achieving effective separation.
Solution Approach 2:
The patent changes the temperature parameter of the bonded wafers by immersing them in a hot bath. The temperature is raised to a specific range where the bonding material's properties change, enabling easy separation. This parameter change transforms the separation process from mechanically-intensive to thermally-assisted.
2Force
If hot bath method is used to peel bonded wafers, then mechanical load is reduced, but additional equipment and process complexity are introduced
Solution Approach 1:
The hot bath unit serves multiple functions: it heats the bonded wafers for separation, and can potentially serve other thermal processing needs in the semiconductor manufacturing line. This multi-functionality justifies the addition of equipment by reducing overall process complexity elsewhere.
Solution Approach 2:
The hot bath acts as an intermediary medium between the bonded wafers and the separation process. Instead of direct mechanical contact, the thermal energy from the hot bath mediates the separation by modifying the bonding material's properties, making the process gentler and more controllable.
3Force
If thermal expansion is used to separate wafers, then separation is achieved with minimal mechanical load, but precise temperature control is required
Solution Approach 1:
The hot bath unit incorporates temperature control mechanisms with feedback systems that monitor and adjust the heating process. This ensures the temperature remains within the optimal range for separating the bonding material without damaging the wafers, achieving precise control necessary for successful thermal separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the peeling of bonded wafers with almost no mechanical load, reducing damage and improving yield by using thermal expansion to separate the wafers effectively, while maintaining precise control over the peeling process.
Implementation Method 1
utilize thermal expansion to gently separate the wafers with minimal mechanical load
Implementation Method 2
A manufacturing apparatus and method that uses a hot bath with a boiling liquid to apply pressure
Data Source
AI summary
According to one embodiment, a manufacturing apparatus includes: a storage configured to store a work; a transfer arm configured to transfer the work; a hot bath configured to store a liquid; a mounting table configured to mount the work in the hot bath; and an upper arm configured to apply pressure to the work mounted on the mounting table.