Hot Melt Adhesive Composition for Long Open Time and Secure Paper Packaging
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Solution Overview
Problem
Existing hot melt adhesive technologies fail to meet the demands of e-commerce paper packaging due to poor bonding to dense papers, lack of heat resistance, and inability to secure the bond within typical use temperatures, leading to resealable packaging that is undesirable for secure applications.
Innovation Solution
A hot melt adhesive composition comprising a thermoplastic block copolymer, tackifier, and a plasticizer blend with a solid and liquid plasticizer, which provides long open time and secured bonding, ensuring cohesion and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If high amounts of cyclohexane dimethanol dibenzoate plasticizer are used to achieve long open time, then open time is extended, but bonding strength to paper deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the plasticizer from pure cyclohexane dimethanol dibenzoate to a blend containing esters of dicarboxylic acids (adipic, pimelic, suberic, azelaic, sebacic acid) with specific molecular weight ranges (500-2000 g/mol). This parameter change optimizes both open time and bonding strength by selecting plasticizers with appropriate molecular characteristics that balance liquidity duration with adhesion capability.
Solution Approach 2:
The patent creates a composite plasticizer system by combining multiple ester components with specific molecular weight ranges. The composite consists of esters of dicarboxylic acids (5-30 wt%), esters of monocarboxylic acids (30-70 wt%), and additional plasticizers (5-30 wt%), forming a synergistic mixture that simultaneously provides extended open time and strong paper bonding.
2Speed
If conventional hot melt adhesive compositions are used to achieve fast bonding, then bonding speed is improved, but heat resistance deteriorates
Solution Approach 1:
The patent modifies the polymer component parameters by specifying polyethylene polymers with specific density ranges (0.910-0.960 g/cm³) and melting point ranges (80-120°C), as well as polypropylene polymers with specific melting point ranges (100-160°C). These parameter specifications enable the adhesive to maintain fast bonding characteristics while achieving superior heat resistance up to 80°C.
Solution Approach 2:
The patent creates a composite polymer system combining polyethylene (30-70 wt%) and polypropylene (20-50 wt%) with specific physical properties. This composite polymer matrix provides both rapid bonding capability and enhanced thermal stability, resolving the contradiction between bonding speed and heat resistance.
3Strength
If conventional adhesive compositions are used to achieve initial adhesion, then bonding is achieved quickly, but bond security against resealing deteriorates
Solution Approach 1:
The patent specifies precise compositional parameters including plasticizer blends with specific ester types and molecular weights, polymer types with specific melting points and densities, and tackifier resin content ranges (10-40 wt%). These parameter optimizations ensure that the adhesive provides strong initial adhesion while creating bonds that cannot be easily resealed, enhancing reliability for secure packaging applications.
Solution Approach 2:
The patent formulates a composite adhesive system integrating optimized polymer matrices, specific plasticizer blends, and tackifier resins. This composite composition creates a synergistic effect where the combination of components provides both strong initial bonding and permanent bond security that prevents resealing, addressing the contradiction between initial adhesion and bond reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition exhibits long open time, strong adhesion, and heat resistance, making it suitable for automated packaging lines and securing paper packaging against resealing.
Implementation Method 1
comprising a plasticizer blend, wherein said plasticizer blend comprises a solid plasticizer P1 and a liquid plasticizer P2
Implementation Method 2
10 to 60 wt.-% of a thermoplastic block copolymer
Implementation Method 3
Hot melt adhesives were found to be suitable adhesives in the production of paper packaging due to their solvent-free nature, fast forming bonding
Implementation Method 4
30 to 70 wt.-% of a tackifier
Implementation Method 5
the adhesive composition exhibits long open time, strong adhesion, and heat resistance, making it suitable for automated packaging lines and securing paper packaging against resealing
Data Source
AI summary
The present invention relates to a hot melt adhesive composition for secured paper packaging which comprises a plasticizer blend, the use of said hot melt adhesive composition in secure paper packaging as well as an article produced with the inventive hot melt adhesive composition.