Hot Melt Adhesive Low-Temperature Application Cobwebbing
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Solution Overview
Problem
Hot melt adhesives used in paper processing and woodwork often require high temperatures to reduce cobwebbing, which can be detrimental to application lines, and lack sufficient heat resistance and open time for complex or wet base materials.
Innovation Solution
A hot melt adhesive comprising an ethylene-based copolymer and a carboxylic acid or carboxylic acid anhydride-modified olefin copolymer wax, specifically maleic anhydride-modified olefin copolymer wax, which allows for low-temperature application while maintaining high heat resistance and suitable open time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If high temperature application is used to reduce cobwebbing, then cobwebbing property is improved, but applicability to base material deteriorates due to adverse effects on application line
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive system by introducing a specific low-viscosity component (viscosity 5-500 mPa·s at application temperature) that fundamentally alters the flow and solidification characteristics, enabling cobwebbing reduction without high temperature
Solution Approach 2:
The patent creates a composite adhesive system combining multiple components with specific viscosity ranges and chemical characteristics, where the synergistic interaction between components achieves both low-temperature applicability and cobwebbing prevention
2Object-affected harmful factors
If low temperature application is used to protect application line, then applicability is improved, but heat resistance deteriorates
Solution Approach 1:
The patent modifies the thermal transition parameters of the adhesive by selecting components with specific glass transition temperatures and melting points, allowing the adhesive to remain stable at application temperatures while maintaining structural integrity at elevated temperatures
Solution Approach 2:
The composite adhesive formulation combines components with complementary thermal properties, where one component provides low-temperature flow characteristics while another component ensures high-temperature stability and resistance
3Productivity
If short open time is used to increase productivity, then manufacturing speed is improved, but adhesion quality deteriorates for complex base materials
Solution Approach 1:
The patent creates a dynamic adhesive system where viscosity and open time are optimized to match the specific processing requirements, allowing sufficient working time for complex geometries while maintaining productivity through controlled solidification rate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves excellent applicability at low temperatures, maintains heat resistance, and provides a suitable open time, preventing adverse effects on application lines and ensuring sufficient time for paper product manufacturing processes.
Implementation Method 1
It is applied to an adherend by being heated and melted, and expresses adhesion after being cooled and solidified
Implementation Method 2
It is applied to an adherend by being heated and melted, and expresses adhesion after being cooled and solidified
Data Source
AI summary
The present invention provides a hot melt adhesive which is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Moreover, the present invention provides a paper product produced by using the hot melt adhesive. The present hot melt adhesive comprising (A) an ethylene-based copolymer and (B) a wax, wherein (B) the wax comprises (Bl) a carboxylic acid or carboxylic acid anhydride- modified olefin copolymer wax, is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Furthermore, a paper product produced by using the present hot melt adhesive is provided.