Hot Melt Adhesive Composition Low Viscosity Processing
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Solution Overview
Problem
Existing hot melt adhesives face challenges with phase separation, bleeding, and reduced adhesive strength due to incompatibility, along with high viscosity and temperature requirements for processing, which limits their use in applications requiring low viscosity and low melting temperature.
Innovation Solution
A hot melt adhesive composition is developed, comprising a styrene-butadiene-styrene triblock copolymer and a styrene-isoprene-styrene triblock copolymer, along with a tackifier and plastic oil, which maintains low viscosity and allows for processing at relatively low temperatures, while enhancing adhesive strength, heat resistance, and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the hot melt adhesive contains base resin and additives to improve adhesive strength, then adhesive strength is improved, but phase separation and bleeding occur due to incompatibility
Solution Approach 1:
The patent modifies the molecular structure parameters of the base resin by introducing specific copolymer compositions (ethylene-propylene-diene copolymer with controlled vinyl content and molecular weight) to achieve compatibility between different components, preventing phase separation while maintaining adhesive strength
Solution Approach 2:
The patent creates a composite adhesive system by carefully selecting and combining multiple components (base resin, tackifier, viscosity modifier) with compatible chemical structures and properties, ensuring homogeneous mixing and stable composition without bleeding or phase separation
2Strength
If the hot melt adhesive has high viscosity for good adhesive strength, then adhesive strength is improved, but processing requires relatively high temperature conditions
Solution Approach 1:
The patent adjusts the viscosity parameter by selecting base resin with specific molecular weight range (10,000-100,000) and adding viscosity modifiers, achieving low viscosity at processing temperature while maintaining high adhesive strength through optimized composition
3Ease of manufacture
If the hot melt adhesive is processed at high temperature to reduce viscosity, then processability is improved, but viscosity change, odor generation, and discoloration occur
Solution Approach 1:
The patent optimizes the processing temperature parameter to a lower range (80-120°C) by using resin composition with lower melting point and controlled viscosity, avoiding thermal degradation, odor generation, and discoloration while maintaining good processability
Solution Approach 2:
The patent selects base resin and additives with high thermal stability and low odor generation characteristics, using materials that resist degradation at processing temperatures, preventing harmful emissions and maintaining product quality
4Temperature
If the hot melt adhesive has low melting temperature for easy processing, then processability is improved, but heat resistance such as softening point is low
Solution Approach 1:
The patent carefully selects base resin with specific glass transition temperature and melting point parameters, using copolymer composition that provides low melting temperature for easy processing while maintaining adequate heat resistance through molecular structure design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves excellent adhesive strength, heat resistance, and mechanical properties after curing, while maintaining low viscosity and allowing for efficient processing at lower temperatures, making it suitable for various industrial applications.
Implementation Method 1
there may be a problem that phase separation and a bleeding phenomenon occur due to incompatibility
Implementation Method 2
A hot melt adhesive is a thermoplastic resin that is melted by heat, thereby forming an adhesive surface
Implementation Method 3
it can be easily applied and pressed onto a substrate or an adherend, and then cooled and solidified at room temperature within several seconds
Data Source
AI summary
A hot-melt adhesive composition includes a styrene-butadiene-styrene triblock copolymer and a styrene-isoprene-styrene triblock copolymer. The hot-melt adhesive composition enables melt processing at a relatively low temperature because of having a low viscosity properties are property and thus exhibits excellent adhesive strength and heat resistance while improving the processability. In particular, the melt adhesive composition has excellent mechanical properties after curing, and thus can be used in various industrial fields.