Discontinuous Hot Melt Adhesive Patch Patterns for Labels
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Solution Overview
Problem
Conventional hot melt adhesive labels require flood coating on the backsides, which increases manufacturing costs due to the need for more adhesive product and is difficult to work with due to its viscosity.
Innovation Solution
The use of discontinuous hot melt adhesive patch patterns applied in layers on the backsides of labels, which allows for repositionability without losing adhesive tack, and can be applied using hot melt modules with nozzles or stamp wheels with oscillating mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hot melt adhesive is flood coated on the backsides of labels, then high tack bonding is achieved, but adhesive usage increases and manufacturing costs increase
Solution Approach 1:
The patent divides the continuous adhesive layer into discrete adhesive patches positioned at specific locations on the label backsides. These patches are applied in a pattern rather than as a flood coat, reducing the total quantity of adhesive used while maintaining bonding strength at critical attachment points.
Solution Approach 2:
The patent applies adhesive with different properties (discrete patches vs. continuous flood coat) to different areas of the label backside. High adhesive concentration is localized to specific patches where bonding is needed, while other areas receive no adhesive, optimizing both performance and material usage.
2Strength
If hot melt adhesive is flood coated on the backsides of labels, then high tack bonding is achieved, but manufacturing complexity increases due to viscosity handling
Solution Approach 1:
The patent segments the adhesive application process into discrete patch placements rather than requiring uniform flood coating. This simplifies the manufacturing process by allowing precise, localized application that is easier to control and less sensitive to viscosity variations.
Solution Approach 2:
The patent replaces the mechanical flood coating system with a more controlled application method (such as die-cut adhesive layers or precision dispensing) that better handles the viscous hot melt adhesive, reducing manufacturing complexity.
3Quantity of substance
If discontinuous adhesive patches are used, then adhesive usage is reduced, but adhesive repositionability must be maintained
Solution Approach 1:
The patent modifies the physical parameters of the adhesive patches (such as thickness, composition, or thermal properties) to enable repositionability. The adhesive is formulated or structured so that it can be temporarily removed and reapplied without significant loss of bonding strength, despite the discontinuous patch configuration.
Solution Approach 2:
The patent incorporates features into the adhesive patches during manufacturing that pre-enable repositionability, such as controlled adhesion strength or reversible bonding characteristics, allowing the label to be repositioned before final attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces adhesive usage while maintaining high tack properties, enabling labels to be removed and reapplied without loss of adhesive strength, and results in a more cost-effective and efficient manufacturing process.
Implementation Method 1
Hot melt adhesive is a high tack adhesive often flood coated on the backsides of shipping labels. Hot melt adhesives can be reactivated through application of pressure and/or heat once cooled and bonded
Implementation Method 2
Hot melt adhesives bond to diverse ranges of substrates (carboard, metal, plastics, fabric, paper, wood, etc.)
Implementation Method 3
Hot melt adhesives can be reactivated through application of pressure and/or heat once cooled and bonded on the backsides of the labels
Data Source
AI summary
Labels with discontinuous hot melt adhesive patch patterns are provided. Hot melt adhesive is applied to a backside of a substrate for a given label in a discontinuous hot melt adhesive patch pattern. In an embodiment, the hot melt adhesive of a given discontinuous hot melt adhesive patch pattern is layered on the backside of a given label.