Hot Melt Bracket for Wearable Sensor Sealing
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Solution Overview
Problem
Conventional wearable devices face challenges with infrared sensor packaging, leading to reduced sensitivity, water vapor ingress, and increased volume due to poor packaging effects.
Innovation Solution
A sensor fixing structure utilizing a bracket with a hot melt stake connecting arm that forms a holding section through hot melt processing, securely attaching the sensor to the bracket, ensuring a tight seal and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional packaging methods are used for infrared sensors, then the sensor can be protected, but the packaging effect is poor leading to reduced sensitivity and increased volume
Solution Approach 1:
The device is divided into separate functional modules: the infrared sensor is mounted on an independent circuit board assembly, which is then attached to the bracket. This segmentation allows optimized packaging of each component, improving sensor sensitivity while minimizing overall device volume.
Solution Approach 2:
The circuit board assembly with the infrared sensor is nested within the bracket structure. The bracket serves as a container that holds the sensor assembly in a compact configuration, achieving good packaging effect without compromising sensor performance or increasing device volume.
2Reliability
If conventional packaging methods are used for infrared sensors, then the sensor can be mounted, but water vapor can easily enter the packaged sensor
Solution Approach 1:
The bracket is designed with a sealed structure that acts as a protective shell around the infrared sensor and circuit board assembly. This shell structure prevents water vapor and other harmful factors from entering the packaged sensor, improving reliability without compromising accessibility for maintenance.
3Ease of manufacture
If the sensor structure is loosely packaged, then assembly is easier, but the overall volume increases and detection accuracy decreases
Solution Approach 1:
The infrared sensor is pre-mounted and fixed on the circuit board assembly before the entire assembly is attached to the bracket. This preliminary action ensures proper positioning and secure fixation, maintaining detection accuracy while simplifying the overall assembly process through modular construction.
4Volume of stationary object
If a compact sensor arrangement is used, then device volume is reduced, but foreign matter interference may increase
Solution Approach 1:
The sealed bracket structure creates a protective barrier that prevents foreign matter from reaching the infrared sensor, even in compact configurations. This shell protection maintains detection accuracy while achieving space-efficient packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, sealed, and sensitive infrared sensor arrangement with improved detection accuracy and reduced risk of foreign matter interference, enhancing the overall packaging effect and reducing the device's volume.
Implementation Method 1
the connecting arm forms the holding section by hot melt processing
Data Source
AI summary
A sensor fixing structure, a wearable device and a hot melt device are disclosed. The sensor fixing structure comprises a bracket and a sensor structure. A connecting arm is projectingly provided on the bracket. The connecting arm is a hot melt stake. The sensor structure is covered by the bracket. The connecting arm comprises a connecting section and a holding section. One end of the connecting section is connected to the bracket; the other end of the connecting section is connected to the holding section. The holding section is located at a side of the sensor structure that faces away from the bracket, and the sensor structure is held by the holding section to the bracket. The connecting arm forms the holding section by hot melt processing. The packaging effect of the sensor fixing structure is good, and its overall volume is small.