Hot Melt Cooling Apparatus for Rapid Adhesive Bonding

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Solution Overview

Problem

Existing hot melt adhesive bonding technologies face challenges in achieving adequate bond strength within a reasonable time frame, especially when bonding to non-thermally conductive materials or to moving targets, as the cooling time for the adhesive to solidify can be excessively long.

Innovation Solution

The implementation of a hot melt device equipped with a heat sink that rapidly cools the hot plate and thermoplastic adhesive, combined with a compliance mechanism that allows for axial and angular adjustments to maintain contact with moving targets, significantly reduces the cooling time and ensures effective bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the adhesive is allowed to cool naturally on a non-thermally conductive target, then bond strength is achieved, but the cooling time becomes excessively long (more than a minute)

Engineering Contradiction:

Improvebond strengthVSAvoidcooling time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

A thermally conductive plate is introduced as an intermediary between the heat source and the non-thermally conductive target. The plate rapidly conducts heat away from the adhesive during bonding, then facilitates rapid cooling when the heat source is removed, significantly reducing cooling time while maintaining adequate bond strength.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heating process uses periodic action by applying heat during the bonding phase and then removing it during the cooling phase. This cyclic thermal control allows the adhesive to be molten during application and then rapidly solidify when cooling is initiated, reducing total process time.

Inventive Principle:

Principle #19Periodic action

2Adaptability or versatility

If the target position is not fixed, then the apparatus can accommodate moving targets, but the adhesive cannot maintain contact long enough to cool and create adequate bond strength

Engineering Contradiction:

Improveability to bond moving targetsVSAvoidcontact time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The system employs dynamic elements including a compliant mechanism that can adjust to target movement and maintain contact, and a rapidly deployable cooling system that activates immediately upon contact. This dynamic response allows bonding of moving targets by adapting to position changes while ensuring sufficient cooling time through rapid heat extraction.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The cooling system is pre-positioned and ready for immediate activation upon contact with the target. The compliant mechanism is pre-configured to accommodate expected movement ranges. This preliminary preparation ensures that cooling action begins instantly when bonding occurs, compensating for any target movement during the critical cooling period.

Inventive Principle:

Principle #10Preliminary action

3Strength

If resources are expended to maintain apparatus and target positions during cooling, then bond strength is achieved, but energy consumption increases

Engineering Contradiction:

Improvebond strengthVSAvoidenergy consumption

Core Design Contradiction:

StrengthVSUse of energy by moving object

Solution Approach 1:

The system replaces mechanical positioning systems with a thermally conductive plate-based cooling system. Instead of using energy-intensive mechanical means to maintain precise positioning during cooling, the invention uses thermal conduction through the plate to achieve rapid cooling while allowing greater positional flexibility, thereby reducing energy consumption.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables rapid cooling of the thermoplastic adhesive, reducing the bonding time and ensuring strong adhesion even on non-thermally conductive surfaces, while the compliance mechanism ensures contact with moving targets, making it suitable for applications such as attaching smaller spacecraft to larger ones in space.

Implementation Method 1

a heat sink that contacts an internal side of the heater plate to rapidly cool it

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heater plate, hot plate adapted to contact thermoplastic adhesive

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS20250108401A1Hot melt cooling apparatus and method of use

Publication Date: 2025.04.03 OCEANEERING INTERNATIONAL INC

AI summary

A hot melt device system comprising a hot melt device which comprises a hot melt device, comprising a cooler, a cooler actuator operatively in communication with the cooler, a movable cooler extender operatively in contact with the movable cooler actuator, a hot plate, and a heater operatively in communication with the hot plate, and a thermoplastic adhesive cooler operatively in contact with the hot plate may be used to secure to a target by bringing the thermoplastic adhesive into physical contact with a target; energizing the heater to at least partially liquify the thermoplastic adhesive; bringing the at least partially liquified thermoplastic adhesive into contact with a surface of the target; and allowing the at least partially liquified thermoplastic adhesive to bond to the contacted surface while remaining connected to the contacted surface while allowing the at least partially liquified thermoplastic adhesive to cool to a temperature that is below the thermoplastic adhesive's melting temperature.