Hot-Melt Silicone Lamination With Beam-Cured Dispensing Control
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Solution Overview
Problem
Current methods for manufacturing semiconductor devices using hot-melt curable silicone compositions face challenges with controllability of the curing reaction, storage stability, and adaptability to short curing processes, particularly due to the need for constant heating and the risk of premature curing during the production of semiconductors.
Innovation Solution
A method involving the dispensing of a hot-melt curable silicone composition that is cured using high energy beams, such as ultraviolet light, within a dispensing cartridge or drum, allowing for controlled curing at low temperatures and flexible process timing, with the composition maintaining shape retention at room temperature to prevent dripping and enable precise application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If hot-melt curable silicone composition is heated for dispensing, then meltability and flowability are improved, but curing reaction begins to progress prematurely causing loss of controllability
Solution Approach 1:
A heat-resistant stabilizer is introduced as an intermediary substance that suppresses the curing reaction at elevated temperatures. The stabilizer prevents premature crosslinking during heating and dispensing operations, allowing the composition to remain workable at high temperatures without initiating the curing reaction. After dispensing, the stabilizer is removed (e.g., by heating to a specific temperature or through decomposition), allowing the curing reaction to proceed normally.
Solution Approach 2:
The invention changes the temperature parameter profile to control the curing reaction. The composition is heated to a first temperature range (e.g., 50-100°C) for dispensing where the stabilizer suppresses curing, then heated to a second higher temperature range (e.g., 100-200°C) after dispensing to remove the stabilizer and initiate curing. This two-stage temperature parameter change resolves the contradiction between needing heat for dispensing and avoiding premature curing.
2Stability of the object's composition
If room temperature curable silicone composition is used, then storage stability is improved, but curing time becomes too long (7 days) for semiconductor production
Solution Approach 1:
The heat-resistant stabilizer performs a preliminary action by suppressing the curing reaction during storage, handling, and dispensing operations. This preliminary suppression allows the composition to be stored and processed without curing, then after dispensing, the stabilizer is removed allowing rapid curing to proceed. This preliminary action resolves the contradiction by decoupling storage stability from curing speed.
Solution Approach 2:
The invention enables continuous processing by allowing the composition to remain in a stable, uncured state during dispensing operations, then immediately transitioning to rapid curing after dispensing. The stabilizer ensures continuous stability during handling, while subsequent removal of the stabilizer enables continuous rapid curing, eliminating the 7-day delay of room temperature curable compositions.
3Adaptability or versatility
If hot-melt curable silicone composition is used for dispensing, then adaptability to dispenser processing is improved, but curing reaction progress upon heating causes controllability issues
Solution Approach 1:
The heat-resistant stabilizer acts as an intermediary that enables adaptability to hot dispensing processes while maintaining controllability. The stabilizer suppresses curing during the dispensing operation, allowing the composition to be pumped and dispensed like a typical hot-melt material. After dispensing, the stabilizer is removed allowing curing to proceed controllably. This intermediary resolves the contradiction between adaptability and controllability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable and controlled curing of the silicone composition, allowing for high-speed curing at low temperatures, improved controllability of the curing reaction, and flexible process design, resulting in a laminate body with excellent storage stability and adaptability for various applications in semiconductor and electronic component manufacturing.
Implementation Method 1
a curable silicone composition which is cured by irradiation with a high energy beam
Implementation Method 2
irradiation with a high energy beam such as ultraviolet light or an electron beam
Implementation Method 3
heating and melting the curable silicone composition
Implementation Method 4
hot-melt curable silicone compositions have become increasingly popular from the viewpoint of ease of handling
Data Source
AI summary
Provided is a method of manufacturing a laminate body using a hot-melt curable silicone composition that is compatible with liquid dispensing by a dispenser, has excellent controllability of reaction due to suppressed curing reactivity at the dispensing temperature, wherein the curable silicone composition can be cured at high speed after dispensing. A method of manufacturing a laminate body, including a step of: dispensing a curable silicone composition having hot-melt properties as a whole, a melt viscosity at 100° C. (measured by a flow tester) of 50 Pa·s or less, and curable by irradiation with a high energy beam in a form filled in a dispensing cartridge onto a portion or all of a surface of at least one substrate; and optionally irradiating the composition with a high energy beam to cure the composition.