Hot-Melt Silicone Sealant Composition for Strong Semiconductor Bonding
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Solution Overview
Problem
Current hot-melt curable silicone compositions used as sealants for semiconductor devices lack sufficient mechanical strength and substrate bonding strength compared to epoxy-based materials, necessitating a composition with improved handleability and curing properties.
Innovation Solution
A hot-melt curable silicone composition comprising a hot-melt organopolysiloxane resin, an organosiloxane compound with a high alkenyl group content, organohydrogenpolysiloxane, a hydrosilylation catalyst, and a high functional inorganic filler content, which provides enhanced mechanical strength and bonding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If hot-melt curable silicone compositions are used as sealants, then handleability and heat resistance are improved, but mechanical strength and substrate bonding strength become inferior compared to epoxy-based materials
Solution Approach 1:
The patent changes the chemical composition parameters of the silicone resin by incorporating specific ratios of vinyl groups (0.01-0.5 mol per SiO2 unit) and controlling the siloxane unit composition (M, D, T, Q units). This compositional parameter adjustment enables the cured product to achieve both hot-melt handleability and enhanced mechanical strength, resolving the contradiction between ease of operation and strength.
Solution Approach 2:
The patent creates a composite curable composition by combining hot-melt organopolysiloxane resin with specific organosiloxane compounds containing alkenyl groups, organohydrogenpolysiloxane, and inorganic fillers. This composite formulation integrates the advantages of different materials to achieve both good handleability during application and high mechanical strength in the cured state.
2Temperature
If hot-melt curable silicone compositions are used as sealants, then heat resistance is improved, but substrate bonding strength becomes inferior compared to epoxy-based materials
Solution Approach 1:
The patent adjusts the chemical parameters by incorporating vinyl-containing siloxane units at controlled amounts (0.01-0.5 mol per SiO2 unit) and optimizing the ratio of different siloxane units. This parameter optimization enables the cured silicone to maintain heat resistance while achieving superior substrate bonding strength, resolving the contradiction between temperature resistance and bonding strength.
Solution Approach 2:
The patent formulates a composite system combining hot-melt organopolysiloxane resin with crosslinking agents (organosiloxane compounds with alkenyl groups and organohydrogenpolysiloxane) and inorganic fillers. This composite structure provides both heat resistance and enhanced bonding strength to substrates, overcoming the limitations of conventional silicone sealants.
3Temperature
If conventional silicone-based curable compositions are used, then heat resistance is maintained, but mechanical strength remains inferior to epoxy-based sealants
Solution Approach 1:
The patent fundamentally changes the molecular structure parameters by incorporating vinyl groups at specific concentrations (0.01-0.5 mol per SiO2 unit) and controlling the siloxane unit composition (M, D, T, Q units in specific ratios). These parameter changes transform conventional silicone into a high-strength material that maintains heat resistance while achieving mechanical strength comparable to or exceeding epoxy-based sealants.
Solution Approach 2:
The patent develops a composite curable composition integrating hot-melt organopolysiloxane resin with crosslinking agents and inorganic fillers. This composite formulation achieves synergistic effects where the crosslinking network provides mechanical strength while the silicone base maintains heat resistance, resolving the contradiction between these two properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits excellent mechanical strength, bonding strength, and handleability, making it suitable for semiconductor devices with improved gap filling properties and curing characteristics, while maintaining high hardness and toughness from room temperature to high temperatures.
Implementation Method 1
a hot-melt curable silicone composition containing a hot-melt organopolysiloxane resin, an organosiloxane compound containing a certain amount or more of an alkenyl group in the molecule that functions as a regulator of crosslinking density
Data Source
AI summary
Provided is a curable silicone composition having excellent handleability, and curing properties during sealing due to good hot-melt properties and low melt viscosity, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt organopolysiloxane resin containing M and T units in certain ratios and having alkenyl groups; (B) an organosiloxane compound containing a specific siloxane unit and containing 10 mass % or more of an alkenyl group; (C) an organohydrogensiloxane compound; (D) a hydrosilylation catalyst; and (E) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (D). The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.