Heat treatment method of substrate and apparatus thereof
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Solution Overview
Problem
Existing heat treating methods for semiconductor substrates face challenges in maintaining precise temperature control, leading to overshooting and process variations due to the substrate disturbing the hot plate's temperature and inadequate control over temperature profiles.
Innovation Solution
A heat treatment method where a temperature profile is set as a reference for the hot plate's stabilization to a target temperature, allowing for stepwise control of the hot plate's temperature using a heater, temperature sensor, and controller, enabling precise temperature management across different zones and intervals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If temperature control is performed by setting one target temperature, then the control method is simple, but temperature overshooting occurs and process variations increase
Solution Approach 1:
The patent divides the temperature control process into multiple segments by setting different target temperatures for different time intervals. Instead of using a single target temperature, the controller applies a sequence of target temperatures (first target temperature, second target temperature, etc.) during the stabilization period, allowing precise control of the temperature profile and preventing overshooting while maintaining manageable control complexity.
2Productivity
If the substrate is loaded on the hot plate maintained at process temperature, then the heat treatment process can proceed, but the substrate disturbs or changes the process temperature causing instability
Solution Approach 1:
The patent prepares the hot plate by heating it to a first target temperature before loading the substrate. This preliminary action ensures the hot plate is already at the required process temperature when the substrate is loaded, minimizing temperature disturbance. After loading, the controller then stabilizes the temperature to a second target temperature, ensuring both productivity and temperature stability.
3Ease of operation
If temperature control uses a single target temperature, then the control system is simple to operate, but the temperature profile (increase rate, decrease rate) cannot be controlled to desired specifications
Solution Approach 1:
The patent implements dynamic temperature control by adjusting the target temperature at different time intervals. The controller transitions from a first target temperature to a second target temperature based on the stabilization process requirements, enabling precise control of temperature increase and decrease rates while maintaining ease of operation through automated control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes overshooting and ensures uniform temperature control, achieving desired temperature profiles and reducing process variations across the substrate, thereby improving the heat treating process.
Implementation Method 1
a heater configured to heat the hot plate
Implementation Method 2
a temperature sensor configured to detect a temperature of the hot plate
Implementation Method 3
a hot plate supporting the substrate
Data Source
AI summary
A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot plate supporting the substrate on the basis of the reference.