Hot Runner Manifold Common Plane Thermal Insulation

Solution Overview

Problem

Orienting sub-manifolds in a common plane for injection molding systems results in increased heat transfer from the sub-manifolds to the colder mold plate, leading to energy wastage.

Innovation Solution

A hot runner apparatus with a bridge manifold positioned between sub-manifolds in a common plane, where the sub-manifolds are urged against the bridge manifold to form a seal, reducing direct contact with the mold plate and incorporating hollow regions and contact pads to minimize heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If sub-manifolds are oriented in a common plane, then the device complexity is reduced and ease of manufacture is improved, but heat transfer from sub-manifolds to the mold plate increases causing energy loss

Engineering Contradiction:

Improvemanifold arrangement complexityVSAvoidheat transfer loss to mold plate

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces an intermediary substance (insulating material or air gap) between the sub-manifolds and the mold plate. This intermediary layer acts as a thermal barrier that reduces heat transfer from the hot sub-manifolds to the colder mold plate, thereby resolving the energy loss problem while maintaining the common plane orientation configuration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a simple, easily manufactured insulating layer (such as a thin air gap or basic insulating material) between the sub-manifolds and mold plate. This approach uses a low-cost, simple solution to address the heat transfer issue without requiring complex or expensive modifications to the manifold system.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Ease of operation

If sub-manifolds are oriented in a common plane, then ease of operation is improved, but heat transfer from sub-manifolds to the mold plate increases

Engineering Contradiction:

Improvemanifold installation easeVSAvoidheat transfer loss to mold plate

Core Design Contradiction:

Ease of operationVSLoss of energy

Solution Approach 1:

The patent introduces an intermediary substance (insulating material or air gap) between the sub-manifolds and the mold plate. This intermediary layer acts as a thermal barrier that reduces heat transfer from the hot sub-manifolds to the colder mold plate, thereby resolving the energy loss problem while maintaining the common plane orientation configuration.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If sub-manifolds contact the mold plate directly, then manufacturing precision is simplified, but heat transfer increases causing energy wastage

Engineering Contradiction:

Improvealignment precision requirementVSAvoidheat transfer loss to mold plate

Core Design Contradiction:

Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent introduces an intermediary substance (insulating material or air gap) between the sub-manifolds and the mold plate. This intermediary layer acts as a thermal barrier that reduces heat transfer from the hot sub-manifolds to the colder mold plate, thereby resolving the energy loss problem while maintaining the common plane orientation configuration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a simple, easily manufactured insulating layer (such as a thin air gap or basic insulating material) between the sub-manifolds and mold plate. This approach uses a low-cost, simple solution to address the heat transfer issue without requiring complex or expensive modifications to the manifold system.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces heat transfer from the sub-manifolds to the mold plate, minimizing energy loss and maintaining thermal stability during thermal expansion.

Implementation Method 1

when the bridge manifold and the sub-manifolds thermally expand urging the sub-manifolds against contact regions of a pair of opposing walls of the pocket

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The respective opposing walls define a hollow region separated from the respective contact regions by a wall portion

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS8690563B2Hot runner manifolds interconnected in a common plane

Publication Date: 2014.04.08 MOLD MASTERS (2007) LIMITED

AI summary

A hot runner apparatus includes a mold plate defining a pocket; a plurality of sub-manifolds; and a bridge manifold positioned in the pocket and between the sub-manifolds. The bridge manifold and the sub-manifolds are oriented in a common plane. The bridge manifold receives a melt from a melt source. Each of the sub-manifolds is coupled to the bridge manifold to receive the melt from the bridge manifold via a junction between an opening of a network of melt channels within the bridge manifold and an opening of a network of melt channels within each of the sub-manifolds. The sub-manifolds are urged against the bridge manifold to form a seal therebetween, when the bridge manifold and the sub-manifolds thermally expand urging the sub-manifolds against contact regions of a pair of opposing walls of the pocket. The respective opposing walls define a hollow region separated from the respective contact regions by a wall portion.