Hot Stamping Component Cooling Timing for Microstructure Control

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Solution Overview

Problem

Existing hot stamping processes lack effective control over heating time, air cooling time, and mold cooling time, which affects the quality and consistency of manufactured components, particularly in consideration of material thickness and heating temperature.

Innovation Solution

A method for manufacturing hot stamping components that includes controlling heating time, air cooling time, and mold cooling time using specific equations and parameters such as material thickness, heating temperature, and pressing force, ensuring precise control through Equations 1, 2, and 3.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional hot stamping processes are used without precise control of heating time, air cooling time, and mold cooling time, then the manufacturing process is simple and fast, but the quality and consistency of manufactured components deteriorate

Engineering Contradiction:
Improvequality and consistency of componentsVSAvoidprocess control complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by establishing specific mathematical relationships between process parameters (heating time, air cooling time, mold cooling time) and material properties (thickness, heating temperature). Equation 1 for air cooling time uses parameters at (heating furnace discharge temperature and atmospheric temperature correction coefficient), Tt (heating temperature), bt (material component correction coefficient), t (material thickness), and ct (high temperature material thickness sensitivity correction coefficient) to precisely control the cooling process and achieve consistent component quality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements feedback control by using correction coefficients that account for variations in material properties and process conditions. The equations incorporate feedback mechanisms where the air cooling time and mold cooling time are adjusted based on actual heating temperature, material thickness, and material composition, ensuring quality consistency despite parameter variations.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If heating time and cooling time are extended to improve component quality, then manufacturing precision improves, but productivity decreases

Engineering Contradiction:
Improvecomponent qualityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies dynamics by making the heating and cooling times dynamic rather than fixed. The air cooling time and mold cooling time are dynamically adjusted based on the heating temperature, material thickness, and material properties. This dynamic approach allows the process to achieve high quality components while minimizing unnecessary time extensions, thereby maintaining productivity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent uses parameter changes to optimize the balance between quality and productivity. By establishing specific functional relationships in the equations, the patent determines the minimum necessary heating and cooling times required to achieve target component quality. This prevents excessive time extension while ensuring adequate heat treatment, thus maintaining manufacturing efficiency.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If air cooling time is increased to control material microstructure, then manufacturing precision improves, but loss of time increases

Engineering Contradiction:
Improvemicrostructure controlVSAvoidair cooling time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by controlling the air cooling time before the blank enters the mold. Equation 1 calculates the optimal air cooling time in advance based on heating temperature, material thickness, and material properties. This preliminary control of microstructure development during air cooling ensures that the material is properly prepared for subsequent mold cooling, achieving desired microstructure without excessive time loss.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements skipping by minimizing the air cooling time to only the necessary duration required for microstructure control. Rather than allowing prolonged air cooling, the patent calculates and applies the minimum adequate cooling time using Equation 1, then transitions promptly to mold cooling. This approach achieves microstructure control objectives while reducing unnecessary time loss.

Inventive Principle:
Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the quality and consistency of hot stamping components by optimizing these times, allowing for flexible process design and enhanced quality control, resulting in components with a tensile strength of 1350 MPa or greater and less than 2300 MPa.

Implementation Method 1

a heating process is a process of heating a blank in a heating furnace

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

may utilize a phase transformation and microstructure change of a material during the process

Methodology Applied
Scientific EffectPhase transformation: Phase Change

Implementation Method 3

the blank heated through the heating process may be exposed to room temperature and air-cooled while being inserted into the mold

Methodology Applied
Scientific EffectAir cooling: Convection

Implementation Method 4

a cooling process is a process of cooling a hot-stamped molded body in a mold

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 5

a cooling process is a process of cooling a hot-stamped molded body in a mold

Methodology Applied
Scientific EffectCooling: Cooling

Data Source

PatentUS20250205768A1Hot stamping component and method of manufacturing the same
Publication Date: 2025.06.26 HYUNDAE STEEL CO LTD
  • US20250205768A1 patent drawing
  • US20250205768A1 patent drawing
  • US20250205768A1 patent drawing

AI summary

The present disclosure provides a method of manufacturing a hot stamping component, the method includes inserting a blank into a heating furnace, heating the blank, and transferring the heated blank from the heating furnace to a mold, wherein an air cooling time of the blank in the transferring of the blank satisfies Equation 1.