Hotmelt Adhesive Stringing Reduction via Polymer Mixing

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Solution Overview

Problem

Non-reactive hot-melt adhesives often exhibit a high tendency to string when applied through nozzles, leading to the formation of adhesive threads, which can tear off and cause application issues.

Innovation Solution

A hot-melt adhesive system comprising a mixture of polyester-based and polyamide-based adhesives with specific melting point ranges and additives, such as fillers and tackifying resins, is developed to reduce stringing by dynamic mixing and foaming, allowing for regular, trace-like application without thread formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If non-reactive hot-melt adhesives are applied through nozzles, then application is achieved, but adhesive threads form and cause stringing

Engineering Contradiction:
Improveapplication smoothnessVSAvoidadhesive thread formation
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent combines polyester-based hot-melt adhesive (melting point 150-170°C) with polyamide-based hot-melt adhesive (melting point 180-210°C) in specific weight ratios to create a composite adhesive system. This composite formulation exploits the different melting and crystallization behaviors of the two polymers to reduce stringing while maintaining application performance

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the thermal parameters of the adhesive system by selecting specific melting point ranges for the polyester (150-170°C) and polyamide (180-210°C) components. This parameter optimization ensures that the adhesive maintains appropriate viscosity during application and crystallizes properly after application, preventing thread formation

Inventive Principle:
Principle #35Parameter changes

2Object-generated harmful factors

If polyester-based and polyamide-based adhesives are mixed, then stringing tendency is reduced, but formulation complexity increases

Engineering Contradiction:
Improvestringing tendencyVSAvoidadhesive formulation
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent establishes specific parameter ranges for the adhesive components: polyester-based adhesive at 150-170°C melting point, polyamide-based adhesive at 180-210°C melting point, and weight ratios between 20:80 to 80:20. These defined parameters provide a systematic approach that reduces formulation complexity while maintaining effectiveness

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system significantly reduces the stringing tendency, enabling smooth, uninterrupted application of the adhesive to substrates, particularly fibrous materials like paper, with minimal thread formation.

Implementation Method 1

Melting of a first hot-melt adhesive that is polyester-based and a second hot-melt adhesive that is polyamide-based

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

dynamic mixing of the two hot-melt adhesives, in particular with the generation of shear forces in the melt

Methodology Applied
Scientific EffectDynamic mixing with shear forces: Shear Stress

Implementation Method 3

optional foaming of the molten hot-melt adhesive system with a gas

Methodology Applied
Scientific EffectFoaming: Foam

Data Source

PatentEP2598592B1Hotmelt adhesive and process for preparing a hotmelt adhesive
Publication Date: 2016.03.16 MANN HUMMEL GMBH
  • EP2598592B1 patent drawingFigure 1

AI summary

The invention relates to a hotmelt adhesive comprising a hotmelt adhesive mixture, the mixture comprising a. 15-85% by weight of a first, polyester-based hotmelt adhesive, b. 15-85% by weight of a second, polyamide-based hotmelt adhesive.