Hotplate Laser Layer Removal for Precise Metallic Coating Patterning
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Solution Overview
Problem
Conventional methods for applying layers to hotplates, particularly those with metallic and dielectric layers, face challenges in precision and complexity, especially when creating thin lines or recesses, often resulting in unintended removal of layers and imprecise implementation.
Innovation Solution
A method involving the application of a metallic layer and a differing non-conductive layer under the hotplate, followed by precise removal of the metallic layer using laser light from the top side, allowing for improved precision and minimal impact on the underlying layer, with the laser light focused to achieve specific line widths and thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to apply layers and create recesses on hotplates, then the process can be completed with standard equipment, but the precision of thin lines and recesses is poor and layers are unintentionally removed
Solution Approach 1:
The patent inverts the conventional sequence by first applying complete layers across the entire hotplate surface and then selectively removing the metallic layer in specific regions using laser irradiation. This reverse approach allows precise definition of recesses and thin lines through controlled removal rather than imprecise initial application, directly resolving the contradiction between manufacturing precision and process complexity
Solution Approach 2:
The patent replaces conventional mechanical or chemical etching methods with laser irradiation for selective removal of the metallic layer. The laser provides non-contact, highly localized energy delivery that achieves precise material removal without the mechanical complexity and imprecision of traditional etching tools, thereby improving manufacturing precision while maintaining process simplicity
2Manufacturing precision
If laser light is used to remove the metallic layer from the hotplate underside, then precision of removal is improved and damage to the underlying layer is minimized, but the process requires focusing through the hotplate material
Solution Approach 1:
The patent applies preliminary action by first completing the full layer structure (metallic and dielectric layers) across the entire hotplate surface before performing selective removal. This ensures that the underlying dielectric layer is already in place and protected, so when laser removal occurs, any minimal penetration through the metallic layer does not damage the dielectric layer beneath. This preliminary preparation resolves the contradiction by making the subsequent laser process more tolerant and easier to control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and complex layer structures on hotplates with improved precision and reduced damage to the underlying layer, allowing for precise removal of the metallic layer without affecting the dielectric layer, enhancing the optical appearance and structural integrity.
Implementation Method 1
the metallic layer is removed in regions by means of the laser light
Implementation Method 2
the laser light for removing the metallic layer is irradiated so as to strike the topside of the hotplate and is radiated through the hotplate
Data Source
AI summary
In a method for embodying a hotplate for a hob, at least one metallic layer and a further layer under the metallic layer are formed on an underside of the hotplate. After applying the at least one metallic layer and the further layer, at least one region of the metallic layer is changed by a laser light of a laser beam so that the further layer is recognized when viewing the hob on a topside.