Housing-Integrated Board Connector Assembly for Low Contact Height
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Solution Overview
Problem
The increasing demand for board mating connectors in advanced communication environments, such as 5G, poses a challenge in reducing manufacturing costs and lowering the contact height between connected boards while maintaining effective electrical connections.
Innovation Solution
A method of manufacturing a housing-integrated board mating connector by using a conductive metal housing with a cylindrical ground gasket and dielectric part assembly, where the ground gasket provides elasticity and the dielectric part and signal terminal assembly are press-fitted into the housing insertion hole, allowing for reduced manufacturing costs and lower contact height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If board mating connectors are manufactured as separate completed electrical components and fixed to boards or devices, then reliable electrical connections are achieved, but manufacturing costs increase
Solution Approach 1:
The patent combines the housing of the electrical device with the board mating connector into a single integrated structure. The housing itself forms the outer shell of the connector, eliminating the need for separate housing and connector components. This merging reduces manufacturing steps and costs while maintaining reliable electrical connections through the integrated design.
Solution Approach 2:
The housing of the electrical device serves multiple functions: it acts as both the protective enclosure for the device and as the structural housing for the board mating connector. This multi-functionality eliminates the need for a dedicated connector housing, reducing overall manufacturing complexity and cost while ensuring reliable connections.
2Productivity
If multiple board mating connectors are accommodated within the same area, then data transmission capacity increases, but contact height must be lowered
Solution Approach 1:
The patent employs a spring contact structure that utilizes elastic deformation in the vertical dimension to achieve reliable electrical contact. The spring contacts can compress and expand vertically, allowing for lower overall contact height while maintaining sufficient contact pressure and electrical connectivity. This enables multiple connectors to be accommodated in the same area without increasing the vertical space requirement.
3Reliability
If standard board mating connectors are used, then electrical connections are established, but manufacturing costs and contact height are not optimized
Solution Approach 1:
The patent integrates the board mating connector directly into the housing structure, combining what were previously separate components into a unified assembly. This integration eliminates additional manufacturing steps for assembling separate housing and connector parts, reducing overall manufacturing cost while maintaining reliable electrical connections through the streamlined design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and enables easy maintenance by allowing individual component replacement, while lowering the contact height between boards, thus addressing the cost and space constraints in advanced communication systems.
Implementation Method 1
forming an insertion part slit between opposite ends of the rolled ground gasket to impart elasticity to the ground gasket
Data Source
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AI summary
The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal termina part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.