Housing-Mounted Conductive Contacts via Seed Layer Electroplating
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Solution Overview
Problem
Existing methods for forming charging contacts, electrodes, and antennas on small consumer electronic devices are time-consuming, difficult to implement, and expensive, particularly due to the complexity of overmolding and machining processes.
Innovation Solution
A method involving the deposition of a conductive seed material on a non-conductive housing component, followed by the formation of a bulk conductive contact material, which is then connected to an electronic component through conductive vias, posts, or strips, with optional protective coatings to enhance durability and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If overmolding and machining processes are used to form charging contacts, electrodes, and antennas, then the contacts can be formed on the housing, but the process becomes time-consuming, difficult to implement, and expensive
Solution Approach 1:
The patent replaces complex mechanical overmolding and machining processes with electroplating technology. Instead of using mechanical methods to form contacts directly on the housing, a conductive seed layer is deposited on the housing surface, and then bulk conductive material is electroplated onto the seed layer to form the contacts. This substitution of mechanical processes with electrochemical processes simplifies manufacturing while maintaining contact quality.
Solution Approach 2:
The patent employs a composite structure consisting of a non-conductive housing, a conductive seed layer, and bulk conductive contact material. The seed layer serves as an intermediate layer that bonds the non-conductive housing to the bulk conductive material, creating a composite material system that enables contact formation without requiring the housing material itself to be conductive or requiring complex overmolding processes.
2Reliability
If overmolding and machining processes are used to form charging contacts, electrodes, and antennas, then the contacts can be formed on the housing, but the manufacturing cost increases
Solution Approach 1:
The patent replaces complex mechanical overmolding and machining processes with electroplating technology. Instead of using mechanical methods to form contacts directly on the housing, a conductive seed layer is deposited on the housing surface, and then bulk conductive material is electroplated onto the seed layer to form the contacts. This substitution of mechanical processes with electrochemical processes simplifies manufacturing while maintaining contact quality.
Solution Approach 2:
The patent changes the fundamental parameter of how conductive material is applied to the housing. Instead of mechanically molding or machining conductive material into shape, the process uses electrochemical deposition to build up conductive material layer by layer through controlled electroplating. This parameter change from mechanical shaping to electrochemical deposition reduces manufacturing complexity and cost.
3Device complexity
If a simple conductive layer is deposited on the housing, then the manufacturing process is simplified, but the electrical conductivity and durability may be insufficient
Solution Approach 1:
The patent applies preliminary action by first depositing a conductive seed layer on the housing surface before forming the bulk conductive contacts. This seed layer serves as a foundation that ensures proper adhesion and electrical connectivity. By preparing the surface in advance with a conductive base layer, the subsequent electroplating process can efficiently build up the bulk conductive material with sufficient thickness and conductivity for reliable electrical contact.
Solution Approach 2:
The patent employs a composite structure consisting of a non-conductive housing, a conductive seed layer, and bulk conductive contact material. The seed layer serves as an intermediate layer that bonds the non-conductive housing to the bulk conductive material, creating a composite material system that enables contact formation without requiring the housing material itself to be conductive or requiring complex overmolding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves manufacturability, reliability, and reduces costs by simplifying the process while maintaining sufficient electrical conductivity for charging and sensing applications.
Implementation Method 1
forming a conductive seed material over a non-conductive housing component
Implementation Method 2
forming a bulk conductive contact material over the conductive seed material
Data Source
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AI summary
Electronic devices include a non-conductive housing component (102), a contact (104) comprising a conductive seed material (310) formed over an external surface of the non-conductive housing component (102) and a bulk conductive contact material (312) formed over the conductive seed material (310), and an electronic component connected to the bulk conductive contact material (312) and the conductive seed material (310). Manufacturing methods are also disclosed.