Integrated Housing Cooling Profile Element for Power Electronics
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Solution Overview
Problem
Existing cooling systems for heat-emitting electronic components, particularly in automotive applications, face challenges such as high weight, high production costs, inefficient cooling due to thermal resistance, and susceptibility to dust and liquid particles, as well as manufacturing tolerances affecting the positioning of cooling elements.
Innovation Solution
A liquid heat exchanger with a profile element made of thermally conductive material, featuring two flow channels and a resilient mounting system, is integrated into a housing to efficiently dissipate heat from electronic components while maintaining a defined distance and minimizing space requirements, using a profile element with web areas and sealing elements to prevent media ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an aluminum die-cast housing with cooling plates is used, then robustness and EMC compatibility are improved, but weight and manufacturing cost increase
Solution Approach 1:
The patent combines the housing and cooling system into a single integrated unit. The housing itself serves as the cooling structure with fluid channels formed directly within it, eliminating the need for separate cooling plates attached to the housing. This merging reduces the total weight while maintaining both protective and cooling functions.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides mechanical protection for the electronic component, ensures EMC compatibility, and acts as the primary cooling structure. The fluid channels are formed directly in the housing material, making the housing itself a multi-functional component that replaces both the protective enclosure and the separate cooling plate.
2Strength
If an aluminum die-cast housing with cooling plates is used, then robustness is improved, but manufacturing cost increases
Solution Approach 1:
By integrating the cooling channels directly into the housing structure, the patent eliminates the need for separate cooling plate manufacturing and assembly. This reduces the number of manufacturing steps, tooling requirements, and assembly operations, thereby lowering manufacturing costs while maintaining structural robustness.
Solution Approach 2:
The housing is designed as a multi-functional component that simultaneously provides mechanical protection, EMC shielding, and thermal management. This consolidation reduces the total number of parts that need to be manufactured and assembled, simplifying the manufacturing process and reducing costs associated with multiple die-casting tools and assembly operations.
3Temperature
If a water-cooled cooling plate is used, then cooling capability is improved, but thermal resistance increases
Solution Approach 1:
The fluid channels are formed directly within the housing material itself, creating intimate thermal contact between the housing and the cooling fluid. This eliminates the thermal interface resistance that exists between separate cooling plates and the housing, allowing more efficient heat transfer from the electronic component through the housing to the cooling fluid.
4Temperature
If a mounting frame is used to hold heat exchanger elements, then heat exchange functionality is provided, but protection from dust and liquid particles is insufficient
Solution Approach 1:
The housing serves multiple functions: it provides the structural enclosure that protects against dust and liquid particles, while simultaneously containing the fluid channels for heat exchange. This integrated design ensures that the protective function and thermal management function are combined in a single component, eliminating the need for separate mounting frames that would compromise environmental protection.
5Temperature
If cooling plates are attached externally to the housing, then cooling functionality is added, but space requirements increase
Solution Approach 1:
The cooling channels are formed directly within the housing structure, utilizing the existing space and material of the housing itself. This eliminates the need for external cooling plates that would increase the overall dimensions of the assembly, thereby reducing space requirements while maintaining full cooling functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient cooling with reduced thermal resistance, lower weight, and cost-effective production, while ensuring the profile element remains securely positioned and sealed, even under compressive forces, thus protecting the electronic components from environmental hazards.
Implementation Method 1
at least one profile element is provided made of at least one thermally conductive material
Implementation Method 2
at least one profile element is the liquid heat exchanger and has at least two flow channels for fluid flow
Data Source
Figure 1~2
Figure 3~5
Figure 6~7
AI summary
In an arrangement (1) with a housing (2) for receiving at least one heat-emitting electronic component (6, 6a, 6b), in particular a power electronics component, and with a cooling system for cooling the at least one heat-emitting electronic component (6, 6a, 6b), wherein the at least one heat-emitting electronic component (6, 6a, 6b) is arranged in the housing (2), and wherein the cooling system comprises at least one heat exchanger, the at least one heat exchanger is a liquid heat exchanger and at least one profile element (3) made of at least one thermally conductive material is provided, wherein the at least one profile element (3) is the liquid heat exchanger and has at least two flow channels (37) for fluid flow, and wherein the at least one profile element (3) is arranged in the housing (2) in a predefinable position relative to the at least one heat-emitting electronic component (6, 6a, 6b).