Electronic Device Housing with Contiguous Filled Surface
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Solution Overview
Problem
Conventional electronic device housings, while protecting internal components, often hinder the transmission of electromagnetic waves due to their solid structure, and forming breaks or openings to improve wave transmission makes the devices more susceptible to damage from contaminants.
Innovation Solution
A housing design featuring two distinct portions separated by a gap filled with ink layers, where a protrusion from an insert extends into the gap, and ink layers are disposed to create a contiguous surface, allowing electromagnetic waves to pass through while maintaining structural integrity and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the housing is made solid to improve strength and protection, then structural integrity and contamination prevention are improved, but electromagnetic wave transmission is hindered
Solution Approach 1:
The housing is divided into two separate portions with a gap between them, allowing electromagnetic waves to pass through the gap while maintaining protective enclosure for internal components
Solution Approach 2:
An insert with a protrusion is placed within the gap between housing portions to mediate the space, providing structural support while allowing electromagnetic wave transmission through the controlled gap
2Object-generated harmful factors
If breaks or openings are formed in the housing to improve electromagnetic wave transmission, then wave transmission is improved, but susceptibility to contamination and damage increases
Solution Approach 1:
The housing is segmented into two portions with a controlled gap, providing a pathway for electromagnetic waves while maintaining enclosure integrity to prevent contaminant ingress
Solution Approach 2:
The insert with protrusion acts as an intermediary component within the gap, structurally supporting the opening while the ink layers seal the gap to prevent contamination
3Object-generated harmful factors
If a distinct component is positioned within the break or opening, then electromagnetic wave transmission is improved, but gap size varies over operational life due to wear and failure
Solution Approach 1:
The insert with protrusion serves as a stable intermediary component that maintains consistent gap dimensions, reducing variability caused by wear and thermal expansion
Solution Approach 2:
The ink layers are applied to fill and seal the gap, with the cured ink maintaining stable dimensional parameters that compensate for thermal expansion and wear over time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective transmission of electromagnetic waves without substantial attenuation while maintaining the housing's structural integrity and preventing contamination, ensuring the device's operational reliability and appearance.
Implementation Method 1
disposing a first ink layer within the gap; curing the first ink layer; disposing a second ink layer within the gap and over the first ink layer; curing the second ink layer
Implementation Method 2
allows electromagnetic waves to pass through the housing when sending and/or receiving data
Data Source
AI summary
A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.