Housing Flow Channel Liquid Heat Dissipation
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Solution Overview
Problem
Existing electronic devices face challenges in effectively dissipating heat from heat-generating components, which can lead to unreliable operation.
Innovation Solution
The electronic device incorporates a first housing with a flow channel configured to accommodate heat exchange liquid, allowing for efficient heat dissipation of heat-generating components through the flowing liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat-generating components are used in electronic devices, then functionality and performance are improved, but heat dissipation becomes insufficient leading to unreliable operation
Solution Approach 1:
The patent combines the housing structure with the heat dissipation function by integrating flow channels directly into the housing. The housing serves dual purposes: as the structural enclosure and as the heat dissipation pathway, eliminating the need for separate heat dissipation components and improving thermal management effectiveness
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: structural support, enclosure protection, and heat dissipation. The flow channels embedded in the housing allow it to serve as both the device enclosure and the heat dissipation mechanism, maximizing the utility of each component
2Temperature
If separate heat dissipation structures are added, then heat dissipation capability is improved, but device structure becomes more complex
Solution Approach 1:
The patent merges the housing and heat dissipation structure into a single integrated component. The flow channels are formed within the housing itself, eliminating the need for separate heat dissipation structures and reducing overall device complexity while maintaining effective heat dissipation
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: structural support, enclosure protection, and heat dissipation. This multi-functionality reduces the total number of components needed and simplifies the overall device structure
3Temperature
If multiple components are used for heat dissipation, then heat dissipation effectiveness is improved, but manufacturing cost and assembly difficulty increase
Solution Approach 1:
The patent combines multiple functions into a single housing component with integrated flow channels. This reduces the number of parts that need to be manufactured and assembled, lowering manufacturing costs and simplifying production processes while maintaining heat dissipation effectiveness
Solution Approach 2:
The housing serves as both the structural enclosure and the heat dissipation system, eliminating the need for separate components. This multi-functional design reduces assembly steps and manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly enhances heat dissipation capabilities, simplifies the device structure, and improves reliability by allowing the housing to serve as both the device enclosure and the heat dissipation mechanism.
Implementation Method 1
dissipate heat for the heat generation member through the heat exchange liquid
Implementation Method 2
flow channel is configured to accommodate heat exchange liquid and dissipate heat
Data Source
AI summary
An electronic device includes a first housing and a second housing connected to the first housing. An accommodation cavity is formed between the first housing and the second housing. The electronic device further includes a heat generation member arranged in the accommodation cavity and a flow channel arranged in the first housing. The flow channel is configured to accommodate heat exchange liquid and dissipate heat for the heat generation member through the heat exchange liquid.