Housing for an electronic device internal walls

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Solution Overview

Problem

Electronic devices, such as HVAC control panels, are prone to electrostatic discharge (ESD) events, which can damage sensitive components, and existing solutions do not adequately address the need for improved ease of use, assembly, construction, and reliability.

Innovation Solution

The electronic device incorporates a housing with a printed circuit board, a conductive extender or connector, and a spacer to provide ESD protection by grounding the device and maintaining component separation, while also using temperature compensation models to accurately sense ambient temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a housing with inward extending walls is used to separate regions and provide support, then reliability and structural support are improved, but device complexity increases

Engineering Contradiction:
Improvecomponent protection from ESDVSAvoidhousing structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The housing is segmented into multiple regions using inward extending walls that divide the internal space into separate pockets. These walls create distinct compartments for different electronic components, allowing ESD protection to be applied regionally and providing structural support without requiring a completely complex redesign of the entire housing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The inward extending walls serve multiple functions simultaneously: they provide structural support to the printed circuit board, create separate pockets for component organization, and establish ESD protection zones. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If multiple sensors are placed in separate pockets, then temperature sensing accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature sensingVSAvoidsensor placement
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Different sensors are placed in different pockets within the housing, allowing each sensor to measure temperature in its specific local environment. This local quality approach enables accurate temperature sensing for different components (e.g., display, circuit board) without requiring a single complex sensing system, as each pocket provides a dedicated measurement zone.

Inventive Principle:
Principle #3Local quality

3Reliability

If the housing provides structural support for the printed circuit board, then reliability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvestructural supportVSAvoidhousing construction
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The structural support function is merged into the housing itself through the inward extending walls, eliminating the need for separate support structures or brackets. The housing serves both as the enclosure and as the structural support element, simplifying manufacturing by reducing the number of parts that need to be produced and assembled.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects electronic components from ESD events and enhances the reliability and accuracy of temperature sensing, improving the overall performance and usability of electronic devices.

Implementation Method 1

Electronic devices, such as HVAC control panels, are prone to electrostatic discharge (ESD) events, which can damage sensitive components

Methodology Applied
Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Implementation Method 2

The electronic device incorporates a housing with a printed circuit board, a conductive extender or connector, and a spacer to provide ESD protection by grounding the device

Methodology Applied
Scientific EffectGrounding: Earthing

Implementation Method 3

The electronic device incorporates a housing with a printed circuit board, a conductive extender or connector, and a spacer to provide ESD protection by grounding the device and maintaining component separation

Methodology Applied
Scientific EffectPhysical Separation: Physical Containment

Implementation Method 4

The electronic device incorporates temperature compensation models to accurately sense ambient temperature

Methodology Applied
Scientific EffectTemperature Compensation:

Data Source

PatentUS9803882B2Housing for an electronic device internal walls
Publication Date: 2017.10.31 RESIDEO LLC
  • US9803882B2 patent drawing
  • US9803882B2 patent drawing
  • US9803882B2 patent drawing

AI summary

An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.