Housing Frame Loop for Circuit Board Gap Reduction

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Solution Overview

Problem

The existing sliding-type housing technique for circuit boards in electronic devices results in a large gap between the board and the housing, increasing the risk of water or foreign object entry and requiring additional components for assembly, such as spacers, which complicates the assembly process.

Innovation Solution

A housing design featuring a box component and a lid component with frame portions that combine to form a loop shape around exposed components, allowing for vertical assembly and minimizing the gap between the circuit board and the housing by using deformable portions that securely engage the board without the need for additional spacers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a sliding-type housing technique is used to fix the circuit board, then the circuit board can be housed by inserting it through an opening, but a large gap is formed between the circuit board and the housing

Engineering Contradiction:
Improveease of assemblyVSAvoidgap between circuit board and housing
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The housing is divided into a box component and a lid component that can be assembled together. The frame portion is further segmented into a box-side frame portion and a lid-side frame portion that combine to form a loop shape around the circuit board, enabling precise fitting and gap reduction while maintaining ease of assembly

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The frame portion extends in the thickness direction of the circuit board, creating a three-dimensional loop structure that surrounds the exposed components. This dimensional extension allows the frame to contact and constrain the circuit board edges, eliminating gaps without complicating the assembly process

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If additional components such as spacers are used to reduce the gap, then the gap between the circuit board and housing can be minimized, but the assembly process becomes more complex

Engineering Contradiction:
Improvegap between circuit board and housingVSAvoidassembly process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The frame portion is integrated directly into the box and lid components as built-in structural elements. The box-side frame portion and lid-side frame portion are combined to form a continuous loop that directly contacts and secures the circuit board, eliminating the need for separate spacer components and simplifying assembly

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame portion serves multiple functions simultaneously: it provides structural support for the housing, creates a precise fit around the circuit board edges, and acts as a constraint to eliminate gaps. This multi-functionality removes the need for additional specialized components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240215177A1Housing and electronic device
Publication Date: 2024.06.27 PANASONIC AUTOMOTIVE SYST CO LTD
  • US20240215177A1 patent drawing
  • US20240215177A1 patent drawing
  • US20240215177A1 patent drawing

AI summary

A housing that is to house a circuit board includes: a box component that includes an opening on a side facing the circuit board that is housed; and a lid component that closes the opening of the box component. The box component includes a box-side frame portion, the lid component includes a lid-side frame portion, and when the lid component is attached to the box component, the box-side frame portion and the lid-side frame portion combine into a loop shape to configure a frame portion that corresponds to an outer peripheral shape of an exposed component that is attached to the circuit board and exposed from the housing.