Housing-Integrated Profile Element Cooling for Power Electronics
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Solution Overview
Problem
Existing cooling arrangements for heat-emitting electronic components are inefficient due to high thermal resistance and weight, particularly when using liquid-cooled cooling plates, which also occupy valuable installation space.
Innovation Solution
A cooling arrangement featuring a heat exchanger profile element made of conductive material, secured at its ends within the housing using fixing receiving elements, optimizing heat transfer and minimizing installation space by avoiding clamping elements, which allows for better heat dissipation and increased capacity to accommodate more electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling plates are used to cool heat-generating electronic components, then cooling function is provided, but weight increases and installation space is occupied
Solution Approach 1:
The patent changes the cooling approach from using heavy cooling plates to using a housing with integrated cooling channels. The housing itself is designed with thermally conductive material and internal cooling passages, transforming the housing from a simple protective enclosure to an active heat dissipation system. This parameter change in the housing structure eliminates the need for separate cooling plates, reducing overall weight while maintaining cooling efficiency.
2Temperature
If cooling plates are used to cool heat-generating electronic components, then cooling function is provided, but installation space is occupied and thermal resistance increases
Solution Approach 1:
The patent merges the housing structure with the cooling system by integrating cooling channels directly into the housing. This combination eliminates the need for separate cooling plates and reduces the number of components. The housing simultaneously serves as both the protective enclosure and the heat dissipation structure, reducing overall installation space while improving thermal contact with electronic components.
Solution Approach 2:
The patent extracts the cooling function from a separate cooling plate and integrates it into the housing structure itself. By taking out the cooling functionality and embedding it in the housing, the design eliminates the need for additional cooling plates, reducing installation space and improving thermal efficiency through direct contact between the housing and electronic components.
3Stability of the object's composition
If clamping elements are used to secure the profile element, then the profile element is fixed, but surface area is lost and device complexity increases
Solution Approach 1:
The patent extracts the fixation function from separate clamping elements and integrates it into the housing structure through receiving elements. The receiving elements are built-in features of the housing that directly secure the profile element without requiring external clamps. This extraction of the fixation function eliminates the need for additional clamping elements, preserving cooling surface area and reducing device complexity.
4Stability of the object's composition
If clamping elements are used to secure the profile element, then the profile element is fixed, but device complexity increases
Solution Approach 1:
The patent merges the fixation function into the housing structure by incorporating receiving elements directly into the housing. These receiving elements are integrated features that secure the profile element without requiring separate clamping components. This merging of functions reduces the total number of parts and simplifies the overall device structure while maintaining secure fixation of the profile element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling efficiency and reduces the overall size of the cooling arrangement, enabling more effective heat dissipation and increased capacity to accommodate multiple electronic components within a compact space.
Implementation Method 1
at least one profile element made of at least one thermally conductive material is provided as a heat exchanger and arranged in the housing
Implementation Method 2
a cooling system for cooling the at least one heat-emitting electronic component, wherein the at least one heat-emitting electronic component is arranged in the housing and the cooling system comprises at least one heat exchanger
Data Source
Figure 1~2
Figure 3~4a
Figure 5~6
AI summary
In a cooling arrangement (1) with a housing (2) for receiving at least one heat-emitting electronic component (11), in particular at least one power electronic component, and with a cooling system for cooling the at least one heat-emitting electronic component (11), wherein the at least one heat-emitting electronic component (11) is arranged in the housing (2), and wherein the cooling system comprises at least one heat exchanger, at least one profile element (5) made of at least one thermally conductive material is provided as a heat exchanger and arranged in the housing (2), wherein the at least one profile element (5) is fixed at its end in the housing (2) by at least one fixing receiving element (6, 7) in the housing (2).