Housing with Intersecting Spherical Cavities for Heat Dissipation
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Solution Overview
Problem
Existing electronic device housings are limited in their ability to effectively distribute and reject heat, which restricts the performance of electronic devices and fail to provide enhanced functionality and aesthetic features.
Innovation Solution
A three-dimensional structure with a body having opposing surfaces featuring intersecting spherical or hemispherical cavities that form a matrix of apertures for enhanced heat transfer and structural integrity, allowing for improved heat removal and aesthetic appeal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional solid housing structures are used, then structural integrity is maintained, but heat dissipation capability is insufficient
Solution Approach 1:
The housing incorporates a three-dimensional pattern of intersecting spherical cavities that create a porous-like structure with numerous apertures throughout. This allows heat to be dissipated through multiple pathways while the interconnected spherical geometry maintains structural strength. The cavities are arranged in repeating patterns that balance thermal performance with mechanical integrity.
Solution Approach 2:
The design transitions from traditional two-dimensional heat dissipation surfaces to a three-dimensional network of intersecting spherical cavities. The cavities extend through the housing thickness and intersect to form through-holes, creating thermal pathways in multiple dimensions simultaneously, thereby enhancing heat dissipation without compromising structural integrity.
2Length of moving object
If housing thickness is reduced to make devices thinner, then portability is improved, but heat dissipation surface area is reduced
Solution Approach 1:
The three-dimensional cavity pattern creates thermal pathways that extend through the reduced housing thickness. The intersecting spherical cavities form through-holes that provide direct thermal pathways from one surface to the other, compensating for the reduced thickness by utilizing the third dimension more effectively.
Solution Approach 2:
The housing is segmented into multiple regions with cavities distributed throughout the thickness. This segmentation creates numerous small thermal pathways distributed across the entire housing volume, allowing effective heat dissipation even when the overall housing thickness is reduced.
3Temperature
If complex three-dimensional cavity patterns are implemented, then heat dissipation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The complex three-dimensional pattern is created by repeating a basic unit cell containing intersecting spherical cavities. This modular approach allows the complex geometry to be manufactured using additive fabrication or precision molding techniques applied to repeating units, rather than requiring complex tooling for the entire housing at once.
Solution Approach 2:
The use of spherical and hemispherical cavity shapes simplifies the manufacturing process compared to angular or irregular geometries. Spherical cavities can be created using standard spherical milling tools, laser spherification, or spherical deposition techniques in additive manufacturing, making the complex three-dimensional pattern more manufacturable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively maximizes surface area for thermal transfer, providing enhanced heat removal and maintaining structural integrity while being lightweight and strong, thus improving electronic device performance and user experience.
Implementation Method 1
The body can conduct heat away from a component of the electronic device positioned substantially adjacent to the first surface of the body
Implementation Method 2
The structure effectively maximizes surface area for thermal transfer, providing enhanced heat removal
Data Source
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AI summary
A structure can include a body having a first surface and a second opposing surface. The three-dimensional structure can include the body defining a first pattern of first cavities extending into the body from the first surface and the body defining a second pattern of second cavities extending into the body from the second surface. One or more first cavities can eccentrically intersect with one or more second cavities to define a pattern of apertures in the body.