Housing Middle Frame Groove for Heat Dissipation
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Solution Overview
Problem
Electronic devices face poor heat dissipation due to heat concentration from different components, leading to local overheating, and existing heat dispersing materials like graphite or copper foil are insufficient in dissipating heat effectively without increasing device thickness, posing safety hazards.
Innovation Solution
A housing design incorporating a middle frame with a heat-conducting element and a protective member, where the heat-conducting element is accommodated in an accommodating groove and the protective member is positioned to prevent dislocation, ensuring efficient heat transfer and balance without increasing the device's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dispersing materials like graphite or copper foil are added to improve heat dissipation, then heat transfer capability is improved, but device thickness increases
Solution Approach 1:
The heat-conducting element is nested within the accommodating groove of the middle frame structure, allowing the heat dissipation component to be integrated into the existing device architecture without adding external thickness. The protective member is also nested within the same groove, creating a compact layered arrangement that maintains thin profile while achieving effective heat transfer from electronic components to the housing.
2Temperature
If heat dispersing materials are arranged to cover different component locations, then heat dissipation coverage is improved, but structural complexity increases
Solution Approach 1:
The middle frame with its accommodating groove serves multiple functions simultaneously: it provides structural support for the device, contains the heat-conducting element for thermal management, and positions the protective member to prevent component dislocation. This multi-functional design eliminates the need for separate structural components, simplifying the overall device architecture while maintaining comprehensive heat dissipation coverage across different electronic component locations.
3Reliability
If protective measures are added to prevent heat-conducting element dislocation, then reliability is improved, but device complexity increases
Solution Approach 1:
The protective member is merged with the heat-conducting element assembly within the same accommodating groove of the middle frame. This integrated design provides mechanical protection against dislocation while maintaining thermal conductivity, as the protective member is positioned to shield the heat-conducting element without interfering with its heat transfer function. The combination eliminates the need for separate protective structures, maintaining reliability while minimizing added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents local overheating by transferring heat generated by components to other areas for dissipation, improving heat dissipation efficiency and ensuring the reliability of electronic devices by preventing damage from heat-conducting element dislocation.
Implementation Method 1
the heat-conducting element is accommodated in the accommodating groove... effectively prevents local overheating by transferring heat generated by components to other areas for dissipation
Data Source
AI summary
Provided are a housing and an electronic device. The housing comprises a middle frame, a heat-conducting element and a protective member. The middle frame is provided with a first receiving area configured to receive an electronic component of an electronic device. The middle frame is further provided with an accommodating groove. The accommodating groove penetrates the middle frame and is communicated with the first receiving area. The heat-conducting element is accommodated in the accommodating groove. The protective member is at least partially accommodated in the accommodating groove, and is arranged at a side of the heat-conducting element that faces towards the first receiving area. In the embodiments, the protective member is opposite to or in contact with the electronic component arranged in the first receiving area, and separates the heat-conducting element accommodated in the accommodating groove from the electronic component arranged in the first receiving area.