Electronic Device Housing Nanomold Bonding for PCB Positioning
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Solution Overview
Problem
Existing electronic device housings for compact encoders face challenges such as reduced effective area for component mounting and pattern arrangement on printed circuit boards, increased component count and mounting time, decreased rigidity, and reduced positioning accuracy due to the use of adhesives or fixing screws.
Innovation Solution
The housing incorporates a base part made of aluminum with nanometer-scale asperities and a resin part bonded using a nanomold technique, allowing direct contact between the resin and printed circuit board for enhanced rigidity and positioning accuracy without additional components or adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixing screw is used to fix the insulating part onto the base part, then the positioning accuracy is improved, but the number of components and mounting time increase
Solution Approach 1:
The insulating part and base part are merged into a single integrated component made of aluminum die cast. The insulating part is formed as an integral structure with the base part, eliminating the need for separate fixing screws and reducing the number of components while maintaining positioning accuracy through precise integral forming
Solution Approach 2:
The integrated aluminum die cast component serves multiple functions simultaneously: it provides the base structure, electrical insulation, mechanical strength, and precise positioning features. This multi-functional design eliminates the need for separate insulating parts and fixing mechanisms
2Device complexity
If an adhesive is used to bond the base part to the insulating part, then the number of components is reduced, but the rigidity and positioning accuracy decrease
Solution Approach 1:
The base part and insulating part are merged into a single rigid aluminum die cast component, eliminating the need for adhesive bonding. The integral structure provides inherent rigidity and precise positioning without compromising mechanical strength
Solution Approach 2:
The adhesive bonding mechanism is replaced by integral forming through aluminum die cast technology. The mechanical connection is achieved through the monolithic structure itself, providing superior rigidity and positioning accuracy compared to adhesive bonding
3Device complexity
If the printed circuit board is in direct contact with the metal base part, then the structure is simplified, but the effective area for component mounting is reduced
Solution Approach 1:
The insulating function and base structure are merged into a single integrated component. The insulating part is formed as an integral structure that provides electrical isolation without requiring separate insulating materials, thereby maximizing the effective area of the printed circuit board
4Productivity
If aluminum die cast is used for the base part, then mass productivity is enhanced, but positioning accuracy may be reduced due to surface asperities
Solution Approach 1:
The surface parameters of the aluminum die cast component are optimized by controlling the die cast process to achieve appropriate surface roughness and dimensional accuracy. Process parameters such as injection pressure, temperature, and mold design are adjusted to minimize surface asperities while maintaining mass productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a compact, rigid electronic device housing with improved positioning accuracy and effective use of printed circuit board area, reducing component count and construction time while maintaining structural integrity under harsh environmental conditions.
Implementation Method 1
a resin part fixed to the base part; wherein the base part is made of aluminum including asperities in the nanometer order formed on the surface thereof, wherein the resin part is made of an insulating resin, and wherein the resin of the resin part is bonded to the asperities by way of a key structure to fix together the base part and the resin part
Data Source
AI summary
An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.