Electronic Component Housing Package With Protruding Conductor Bonding
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Solution Overview
Problem
Existing electronic component housing packages face challenges in achieving high bonding strength between the external connection conductor and the insulating substrate, leading to potential deformation and reduced reliability during hermetic sealing and connection to module substrates.
Innovation Solution
The design incorporates a protruding portion of the external connection conductor that extends into the insulating substrate, connected with an inner layer conductor, enhancing bonding strength and dispersing stress, while a surrounding portion suppresses deformation and ensures firm connection to the module substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If external connection conductors are directly connected to inner layer conductors without a protruding portion, then the structure is simpler, but the bonding strength between conductors and substrate is insufficient
Solution Approach 1:
The external connection conductor is designed with a protruding portion that extends in the thickness direction (z-axis) of the insulating substrate, transitioning from a planar two-dimensional connection to a three-dimensional structure. This dimensional change allows the conductor to penetrate through the substrate thickness and make contact with the inner layer conductor, thereby achieving sufficient bonding strength without excessive structural complexity.
2Manufacturing precision
If external connection conductors are directly connected to inner layer conductors, then the manufacturing process is simpler, but deformation occurs during bonding
Solution Approach 1:
The insulating substrate is positioned between the external connection conductor and the inner layer conductor, acting as a cushioning layer that absorbs and distributes bonding stress. This pre-positioned substrate prevents direct contact and potential deformation between the conductors during the bonding process, while the protruding portion of the external connection conductor extends through the substrate to establish electrical connection without causing deformation.
3Reliability
If conductors are closely positioned for compact design, then the package size is reduced, but stress concentration occurs leading to reliability issues
Solution Approach 1:
Instead of increasing horizontal spacing between conductors to reduce stress concentration, the design utilizes the thickness direction (z-axis) by extending the external connection conductor as a protruding portion through the insulating substrate. This vertical extension allows electrical connection without requiring additional horizontal space, maintaining compact package volume while improving connection reliability through the substrate's stress-distributing effect.
Data Source
AI summary
An electronic component housing package includes: an insulating substrate including a main surface; an external connection conductor including a portion exposed at the main surface; and an inner layer conductor located inside of the external connection conductor in a thickness direction of the insulating substrate, in which the external connection conductor includes a protruding portion extending toward the inner layer conductor, and the protruding portion is in contact with the inner layer conductor.