Device Housing Package Signal Line Shielding
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Solution Overview
Problem
Current device housing packages face challenges in achieving excellent high-frequency transmission characteristics while minimizing electromagnetic-wave leakage, especially at microwave and millimeter-wave ranges, due to limitations in signal line design and manufacturing complexities.
Innovation Solution
A device housing package with a substrate and frame body made of high thermal conductivity materials, featuring a continuous metal layer extending along the signal line for efficient heat dissipation and electromagnetic shielding, along with a dielectric layer structure that includes a signal line and ground layers to enhance transmission and reduce leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a signal line is formed on a dielectric layer with ground layers on both sides to improve high-frequency transmission characteristics, then electromagnetic-wave leakage increases
Solution Approach 1:
A coaxial cable structure is introduced as an intermediary between the signal line and external connections. The signal line is coupled to a coaxial cable through a via hole, where the coaxial cable's inherent shielding properties prevent electromagnetic-wave leakage while maintaining high-frequency transmission characteristics. The coaxial cable acts as a mediator that transforms the unshielded microstrip signal into a shielded coaxial signal.
Solution Approach 2:
The signal line is nested within a multi-layer dielectric structure with ground layers positioned above and below it. This nested configuration creates a controlled impedance environment that guides the signal while containing electromagnetic fields. The via hole connecting the signal line to the coaxial cable is also nested within the dielectric layer, providing a transition path that maintains field containment.
2Reliability
If metallized conductor via holes are provided through the ceramic body to improve signal transmission characteristics, then manufacturing complexity increases
Solution Approach 1:
The via hole structure is segmented into distinct functional zones: an upper via hole portion for electrical connection, a lower via hole portion for mechanical support, and a through-hole portion for signal transmission. This segmentation allows each portion to be optimized independently for its specific function, simplifying the manufacturing process while maintaining signal transmission characteristics.
Solution Approach 2:
The via hole is constructed using composite materials including conductive material for electrical connection, dielectric material for insulation, and metallic material for mechanical strength. This composite approach allows each material to contribute its optimal properties, achieving both electrical performance and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a device housing package with improved heat dissipation and reduced electromagnetic-wave leakage, maintaining coaxial signal mode and achieving excellent electrical characteristics, while simplifying the manufacturing process and enhancing production yield.
Implementation Method 1
a metal layer (11) extending from an interior of the frame body (4) to an exterior of the frame body (4) along the signal line (8)
Implementation Method 2
a ground layer (9) surrounding the signal line (8), the ground layer (9) being formed on outer surfaces of the first dielectric layer (7) and the second dielectric layer (10)
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A device housing package (1) includes a substrate (3) having a device (2) mounting region (R) in an upper face thereof; and a frame body (4) having a through hole (H) formed in part thereof, the frame body being disposed on the substrate (3) so as to lie along a periphery of the device mounting region (R). The device housing package (1) includes an input-output terminal (5) disposed in the through hole (H), the input-output terminal having a first dielectric layer (7) extending interiorly and exteriorly of the frame body (4); a signal line (8) formed on the first dielectric layer (7) and configured to provide electrical connection between an interior of the frame body (4) and an exterior thereof; a first ground layer (9a) formed on a lower face of the first dielectric layer (7); a second dielectric layer (10) formed on the signal line (8) so as to overlap the frame body (4) as viewed in a transparent plan view; a second ground layer (9b) formed on an upper face of the second dielectric layer (10); and a metal layer (11) disposed within the second dielectric layer (10) so as to extend from the interior of the frame body (4) to the exterior thereof along the signal line (8). The metal layer (11) is formed to extend from the second dielectric layer (10) to the first dielectric layer (7), being separated from the signal line (8).