Electronic Component Housing Thermal Isolation via Partition Gaps
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Solution Overview
Problem
In microwave power modules, the case housing a heating element can act as a heat conductor, leading to the unintended heating of electronic components with lower heat quantities, and existing solutions like partition plates can still allow heat transfer between high and low heat generating modules, causing temperature rises in lower heat generating components.
Innovation Solution
An electronic component housing apparatus with a case that separates high and low heat generating components using first and second partition plates and gaps between them, preventing direct heat conduction and allowing for efficient cooling of high heat components while isolating lower heat components from excessive heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal case is used to house electronic components, then high processability and high strength are achieved, but heat conduction occurs from high heat-generating components to low heat-generating components through the case
Solution Approach 1:
The case is divided into multiple sections with partition plates creating separate housing chambers for high heat-generating and low heat-generating components. This segmentation prevents heat conduction through the case while maintaining structural strength, as each chamber can be independently thermally managed.
Solution Approach 2:
Partition plates serve as intermediary structures between high and low heat-generating components. These plates create thermal barriers that block heat conduction paths through the metal case, while still allowing the case to provide overall structural support and protection.
2Device complexity
If a single housing chamber is used for all electronic components, then device complexity is reduced, but heat from high heat-generating components adversely affects low heat-generating components
Solution Approach 1:
The single housing chamber is segmented into multiple chambers using partition plates. This allows thermal isolation of high heat-generating components from low heat-generating components while maintaining a relatively simple overall housing structure that can be manufactured as an integrated unit.
Solution Approach 2:
Different regions of the housing are assigned different thermal characteristics. The partition plates create local thermal barriers in specific areas where heat isolation is needed, while other portions of the case can maintain good thermal conduction for cooling purposes.
3Object-affected harmful factors
If partition plates are provided between high and low heat-generating modules, then heat transfer is reduced, but temperature rise in low heat-generating components still occurs through residual heat conduction
Solution Approach 1:
Multiple partition plates are strategically positioned to create comprehensive thermal barriers. This multi-segmented approach blocks residual heat conduction paths that a single partition plate cannot prevent, effectively isolating low heat-generating components from thermal influence.
Solution Approach 2:
The partition plates extend in multiple directions and dimensions within the housing chamber to create a three-dimensional thermal barrier network. This dimensional approach blocks heat conduction paths from multiple angles, preventing temperature rise in sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools high heat components while preventing lower heat components from being subjected to excessive heat, thereby maintaining performance and reducing temperature rises in microwave power modules.
Implementation Method 1
a case housing a first electronic component and a second electronic component having a heat quantity greater than that of the first electronic component
Implementation Method 2
a cooling fan placed in a power storage device, an exhaust port placed in a battery, and a cooling wind flow path for allowing cooling wind taken in from the cooling fan to flow therethrough
Data Source
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AI summary
[Problem] To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, while inhibiting the incidence of the first electronic component being subjected to the heat of the second electronic component, which has a heat quantity greater than that of the first electronic component. [Solution] A case 2100 houses a high voltage power supply module 100 (the first electronic component) and a TWT 200 (the second electronic component), which has a heat quantity greater than that of the high voltage power supply module 100. A first electronic component housing chamber 5000 houses the high voltage power supply module 100. A second electronic component housing chamber 6000 houses the TWT 200. At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.