Electronic Device Housing Partition for Thermal and Rigidity Management

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Solution Overview

Problem

Conventional electronic device housings face challenges in achieving both improved thermal characteristics and torsional rigidity while reducing thickness and weight, and in maintaining antenna performance and preventing battery breakage during accidental falls.

Innovation Solution

The electronic device housing incorporates a partition structure joined to the bottom or top cover, featuring a hollow structure with heat generation members on its surface, a thermally conductive material with controlled thermal conductivity, and a cushioning gap for the battery, ensuring effective heat dissipation and enhanced rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a material having high thermal conductivity is used for the housing, then heat dissipation property is improved, but antenna performance is deteriorated

Engineering Contradiction:

Improveheat dissipation propertyVSAvoidantenna performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The housing is divided into multiple parts: a first housing made of thermally conductive material for heat dissipation, and a second housing made of electrically insulating material for antenna performance. This segmentation allows each part to optimize its function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the housing have different material properties. The first housing portion near heat-generating components uses high thermal conductivity material, while the second housing portion containing the antenna uses electrically insulating material. This local differentiation resolves the contradiction between heat dissipation and antenna performance.

Inventive Principle:

Principle #3Local quality

2Length of moving object

If the housing thickness is reduced, then portability is improved, but torsional rigidity is decreased

Engineering Contradiction:

Improvehousing thicknessVSAvoidtorsional rigidity

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The housing uses composite construction with a resin base material reinforced with fiber reinforcement material. This composite structure achieves high torsional rigidity despite reduced thickness, as the fibers provide structural strength while the overall housing remains thin and portable.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

Instead of increasing thickness to improve rigidity, the invention uses fiber reinforcement that adds strength in a different dimensional approach. The fiber orientation and distribution provide torsional resistance without increasing the housing thickness, maintaining portability while improving rigidity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If a heat pipe is laid on the housing surface, then heat dissipation property is improved, but device weight is increased

Engineering Contradiction:

Improveheat dissipation propertyVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The heat dissipation function is extracted from a separate heat pipe component and integrated directly into the housing structure itself. The housing material provides both structural support and heat dissipation, eliminating the need for an additional heat pipe layer and reducing overall device weight.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing serves multiple functions simultaneously: it provides structural support, electrical insulation, and heat dissipation. By making the housing itself thermally conductive in appropriate regions, the design eliminates the need for separate heat dissipation components, reducing weight while maintaining effectiveness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal characteristics and torsional rigidity while reducing thickness and weight, maintains antenna performance, and effectively prevents battery breakage during accidental drops.

Implementation Method 1

a resin housing having high heat dissipation property is prepared using a material obtained by mixing a polyphenylene sulfide resin with a thermally conductive material having a thermal conductivity of 100 W/m·K or more

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cushioning gap for the battery, ensuring effective heat dissipation and enhanced rigidity

Methodology Applied

Scientific EffectImpact absorption: Damping

Implementation Method 3

the housing is formed of a fiber-reinforced composite material

Methodology Applied

Scientific EffectFiber reinforcement: Composite Materials

Data Source

PatentUS10908651B2Electronic device housing

Publication Date: 2021.02.02 TORAY INDUSTRIES INC

AI summary

An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.