Housing Protrusions Restraining Substrate Thermal Deformation
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Solution Overview
Problem
The existing manufacturing processes for electronic devices, such as SSDs, face challenges in reducing the cost and reliability of connections between semiconductor components and substrates due to thermal expansion, which can lead to connection damage and increased costs from using underfill materials.
Innovation Solution
The implementation of a housing structure with a top cover and bottom cover that includes projections or plates with higher elasticity coefficients and lower thermal expansion coefficients than the substrate, which press the substrate to restrict its thermal expansion and prevent connection damage, thereby maintaining the integrity of solder bumps and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill material is used to reinforce the connection between electronic component and substrate, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the underfill material from the connection structure by introducing a housing that directly restrains the substrate. The housing serves as a structural substitute for the underfill, providing mechanical support and thermal expansion control without requiring additional adhesive materials, thereby reducing manufacturing cost while maintaining connection reliability
Solution Approach 2:
The housing acts as an intermediary element between the substrate and the external environment. It mediates the thermal expansion forces by providing a restraining structure that prevents excessive substrate deformation, thereby protecting the solder connections without requiring underfill material to perform the same protective function
2Reliability
If underfill material is used to reinforce the connection between electronic component and substrate, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of the housing and the underfill reinforcement into a single structural system. The housing simultaneously provides mechanical support, thermal expansion restraint, and connection protection that would otherwise require separate underfill material and structural elements, thereby simplifying the overall device structure while maintaining connection reliability
Solution Approach 2:
The housing is designed to perform multiple functions: it serves as the outer protective enclosure, provides thermal expansion restraint through its rigid structure, and protects the solder connections. This multi-functional design eliminates the need for dedicated underfill materials, reducing structural complexity while maintaining reliability
3Reliability
If housing with projections is used to restrain substrate thermal expansion, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The housing structure is segmented into distinct functional regions: the main housing body and the protruding projections. This segmentation allows the projections to be optimized specifically for thermal expansion restraint while the main body provides overall protection, enabling modular manufacturing and assembly that reduces overall manufacturing complexity despite the added structural feature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses the generation of tensile and compressive stresses in the connection areas, reducing the likelihood of connection damage and maintaining the reliability of electronic device connections without the need for costly underfill materials.
Implementation Method 1
A variety of electronic devices includes a substrate and an electronic component which is mounted on the substrate... use of the underfill may increase a manufacturing cost of the electronic device
Implementation Method 2
protrusions... directly or indirectly urge the substrate in a direction away from the protrusions
Data Source
AI summary
A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.