Electronic Device Housing Structure with Segmented Conductive Member
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Solution Overview
Problem
The challenge is to maintain high rigidity and bonding strength in the housing of electronic devices while reducing their thickness, as conventional manufacturing methods are costly and time-consuming, and the integration of conductive and non-conductive materials in thin housings can lead to reduced bonding forces and rigidity.
Innovation Solution
The solution involves a housing structure with a rear plate and side member formed from electrically conductive materials, where a slit separates the rear plate into portions, filled with insulating material, and a polymer structure contacts the conductive and non-conductive members, with a conductive piece mounted on the polymer structure to enhance bonding and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the housing is reduced, then the overall device size is smaller, but the bonding strength between conductive and non-conductive members is reduced
Solution Approach 1:
The conductive member is divided into multiple segments separated by non-conductive members, creating a segmented antenna radiation pattern. This segmentation allows the conductive members to be distributed throughout the housing volume rather than concentrated in a single thick layer, maintaining bonding strength while reducing overall thickness.
Solution Approach 2:
The housing is constructed as a composite structure combining conductive members (metal) and non-conductive members (polymer or plastic), where the non-conductive members serve dual purposes as both structural bonding elements and antenna segmentation elements. This composite approach enables thin housing design while maintaining adequate bonding strength through the distributed composite structure.
2Manufacturing precision
If full CNC processing is used on six surfaces of extruded metal material, then the external appearance quality is high, but the processing time and costs are considerable
Solution Approach 1:
Multiple housing components (front plate, rear plate, side members) are integrated into a single molded piece through insert injection molding, combining what would otherwise require separate manufacturing and assembly steps. This merging reduces the number of CNC processing operations needed while maintaining high external appearance quality on visible surfaces.
Solution Approach 2:
The manufacturing method transitions from subtractive CNC processing of solid metal blocks to additive/formative injection molding of composite structures. This parameter change in the manufacturing process enables complex segmented structures to be created directly in the desired shape, reducing processing time and costs while maintaining precision.
3Ease of manufacture
If forging and pressing operations are combined with CNC process to reduce processing steps, then the manufacturing cost is reduced, but the rigidity of the product is deteriorated when housing thickness is 1.5 mm or less
Solution Approach 1:
The housing uses a composite structure where non-conductive members are embedded within or between conductive members, creating a distributed reinforcement network. This composite architecture provides rigidity enhancement without requiring increased thickness, allowing thin-walled constructions (1.5 mm or less) to maintain adequate structural stability while being manufactured through cost-effective molding processes.
Solution Approach 2:
The non-conductive members are strategically positioned at specific locations within the housing structure where rigidity enhancement is most needed, such as at joints between conductive segments or in areas requiring antenna isolation. This localized reinforcement approach maintains overall rigidity while minimizing material usage and preserving thin housing design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of electronic devices with improved rigidity and bonding strength in thinner housings, reducing manufacturing time and costs by using a combination of conductive and non-conductive materials with a polymer structure to enhance the structural integrity of the housing.
Implementation Method 1
an insulating material filling the slit
Implementation Method 2
a polymer structure that is in contact with at least one portion of the first portion, at least a portion of the second portion, and at least a portion of the slit
Data Source
AI summary
Various embodiments disclosed in this document relate to an electronic device, for example, an electronic device comprising a conductive piece facing a housing of a metallic material, and an electronic device housing structure.